Compositions Comprising Phase Change Materials and Methods of Making the Same

ABSTRACT

In one aspect, compositions are described herein. In some embodiments, a composition comprises a phase change material, a hydrophobic sorption material, and a viscosity modifier. In some embodiments, a composition comprises a foam and a latent heat storage material dispersed in the foam, the latent heat storage material comprising a phase change material and a hydrophobic sorption material.

RELATED APPLICATION DATA

The present application is a continuation of U.S. patent applicationSer. No. 14/370,300, filed on Jul. 2, 2014, which is the national stageapplication under 35 U.S.C. § 371 of International Application No.PCT/US2012/071988, filed on Dec. 28, 2012, which claims prioritypursuant to 35 U.S.C. § 119(e) to U.S. Provisional Patent Application61/582,549, filed on Jan. 3, 2012, and to U.S. Provisional PatentApplication 61/582,542, filed on Jan. 3, 2012, each of which is herebyincorporated by reference in its entirety.

FIELD

The present invention relates to compositions comprising thermallyactive materials and methods of making the same.

BACKGROUND

In recent years latent heat storage has become increasingly important ina wide array of technologies. Latent heat includes thermal energyreleased or absorbed during a change of state of a material without asubstantial change in the temperature of the material. The change ofstate can include a phase change such as a solid-liquid, solid-gas,liquid-gas, or solid-solid phase change, including a crystalline solidto amorphous solid phase change.

Due to their latent heat storage properties, phase change materials(PCMs) have found application in a wide array of thermal energytechnologies. However, the use of PCMs has been somewhat limited bydisadvantages associated with the phase changes exhibited by some PCMs,including large volume changes, slow transitions, and/or flow in aliquid state.

SUMMARY

In one aspect, compositions comprising a phase change material (PCM) aredescribed herein. In some embodiments, a composition comprises as PCM, ahydrophobic sorption material, and a viscosity modifier. In someembodiments, the viscosity modifier comprises a diisocyanate or ionicliquid. In some embodiments, the PCM is at least partially adsorbed orabsorbed by the hydrophobic, sorption material. Further, in someembodiments, the hydrophobic sorption material partially encapsulatesthe PCM.

A composition described herein, in some embodiments, further comprises alinker component having a chemical functional group capable of forming achemical bond with a phase change material of the composition. Moreover,in some embodiments, a composition described herein comprises a gel.

A composition described herein, in some embodiments, further comprisesone or more additives. For example, in some embodiments, an additivecomprises a thermal conductivity modulator, in some embodiments, acomposition comprises a plurality of additives,

In addition, in some embodiments, a composition described herein has alatent heat of at least about 100 J/g. The latent heat is associatedwith a transition between two condensed phases or states of thecomposition, such as a transition between a solid phase and a liquidphase, between a solid phase and a mesophase, or between two solidstates. In other embodiments, a composition described herein isnon-flammable or substantially non-flammable, In some embodiments, acomposition described herein has a viscosity between about 200centipoise (cP) and about 50,000 cP at a temperature between about −50°C. and about 100° C. and a pressure of about 1 atm.

In another aspect, methods of making a composition comprising a PCM aredescribed herein. In some embodiments, a method of making a compositioncomprises providing a phase change material, providing a hydrophobicsorption material, providing a viscosity modifier, and combining thephase change material, hydrophobic sorption material, and viscositymodifier. In some embodiments, a method further comprises providing alinker component having a chemical functional group capable of forming achemical bond with the phase change material and combining the linkercomponent with the phase change material, hydrophobic sorption material,and viscosity modifier. In addition, in some embodiments, a methoddescribed herein further comprises forming a gel.

In another aspect, methods of making a foam are described herein. Insome embodiments, a method of making a foam comprises combining a phasechange material with a hydrophobic sorption material to provide a firstmixture, combining a polyfunctional monomer with a linker component toprovide a second mixture, and combining the first mixture with thesecond mixture. In some embodiments, the polyfunctional monomercomprises a polyol. In some embodiments, the linker component comprisesan isocyanate. Further, in some embodiments, combining a PCM with ahydrophobic sorption material comprises saturating the hydrophobicsorption material with the PCM. Moreover, in some embodiments, combininga PCM with a hydrophobic sorption material comprises forming a gel.

In addition, in some embodiments, a method described herein furthercomprises providing a second linker component. In some embodiments, thesecond linker component is added to the first mixture prior to combiningthe first mixture with the second mixture. In some embodiments, adding asecond linker component to the first mixture comprises forming achemical bond between the second linker component and the PCM of thefirst mixture, Further, in some embodiments of methods described herein,combining a first mixture with a second mixture comprises cross-linkingone or more components of the first mixture with one or more componentsof the second mixture.

Methods described herein, in some embodiments, further compriseproviding a catalyst. In some embodiments, a catalyst is added to thefirst mixture. In some embodiments, a catalyst is added to the secondmixture. In some embodiments, a catalyst is added to the combination ofthe first and second mixtures.

In addition, in some embodiments, a method described herein furthercomprises providing a blowing agent. A blowing agent, in someembodiments, is added to the combination of the first and secondmixtures.

Further, in some embodiments, a method described herein furthercomprises providing an aqueous polymeric material. An aqueous polymericmaterial, in some embodiments, is added to the combination of the firstand second mixtures.

Moreover, in some embodiments, a method described herein furthercomprises providing one or more additives. One or more additives, insome embodiments, are added to the first mixture. In some embodiments,one or more additives are added to the second mixture. In someembodiments, one or more additives are added to the combination of thefirst and second mixtures.

In some embodiments, a method of making a foam described hereincomprises combining a PCM with a hydrophobic sorption material toprovide a mixture, adding a polyfunctional monomer to the mixture, andadding a linker component to the mixture. In some embodiments, a methodfurther comprises adding a second linker component to the mixture.

In another aspect, compositions comprising a foam are described herein.In some embodiments, a composition comprises a foam and a latent heatstorage material dispersed in the foam, the latent heat storage materialcomprising a PCM and a hydrophobic sorption material. In someembodiments, the hydrophobic sorption material is saturated by the PCM.Moreover, in some embodiments, the hydrophobic sorption material doesnot comprise a microcapsule, such as a microcapsule encapsulating thePCM. Further, in some embodiments, the PCM is chemically bonded to alinker component of the latent heat storage material. In someembodiments, the latent heat storage material comprises a gel.

In addition, in some embodiments, a composition described herein furthercomprises an additive dispersed in the latent heat storage material.Further, in some embodiments, the latent heat storage material is freeor substantially free of water.

These and other embodiments are described in greater detail in thedescription which follows.

DETAILED DESCRIPTION

Embodiments described herein can be understood more readily by referenceto the following detailed description and examples. Elements, apparatus,and methods described herein, however, are not limited to the specificembodiments presented in the detailed description and examples. Itshould be recognized that these embodiments are merely illustrative ofthe principles of the present invention. Numerous modifications andadaptations will be readily apparent to those of skill in the artwithout departing from the spirit and scope of the invention.

In addition, all ranges disclosed herein are to be understood toencompass any and all subranges subsumed therein. For example, a statedrange of “1.0 to 10.0” should be considered to include any and allsubranges beginning with a minimum value of 1.0 or more and ending witha maximum value of 10.0 or less, e.g., 1.0 to 5.3, or 4.7 to 10.0, or3.6 to 7.9.

1. Compositions Comprising a Phase Change Material

In one aspect, compositions comprising a phase change material aredescribed herein. In some embodiments, a composition comprises a phasechange material (PCM), a hydrophobic sorption material, and a viscositymodifier. In some embodiments, the hydrophobic sorption material and theviscosity modifier do not comprise the same material, Further, in someembodiments, a composition comprises a plurality of differing PCMs, aplurality of differing hydrophobic sorption materials, and/or aplurality of differing viscosity modifiers.

Moreover, in some embodiments of compositions described herein, a PCMcomprises an absorbate. For example, in some embodiments, a PCM is atleast partially absorbed by a hydrophobic sorption material describedherein. Further, in some embodiments, a hydrophobic sorption materialcomprises an absorbent. In other embodiments, a PCM is at leastpartially adsorbed by a hydrophobic sorption material. In someembodiments, for instance, a PCM comprises an adsorbate of thehydrophobic sorption material. Moreover, in some embodiments, ahydrophobic sorption material adsorbs or absorbs a hydrophobic portionof a PCM, such as an aliphatic hydrocarbon portion of a PCM.

In addition, in some embodiments, a hydrophobic sorption materialdescribed herein partially encapsulates a PCM. In some embodiments, acomposition described herein comprises a self-encapsulating PCM. In someembodiments, a composition described herein is not encapsulated by amicrocapsule, such as a polymer microcapsule.

In some embodiments, a composition described herein further comprises alinker component. The linker component has a chemical functional groupcapable of forming a chemical bond with a PCM of the composition.Further, in some embodiments, a composition comprises a linker componentchemically bonded to a PCM. In some embodiments, a composition comprisesa plurality of differing linker components.

Moreover, in some embodiments, a composition described herein comprisesa gel. A gel, in some embodiments, comprises a continuous phase formedfrom PCM of the composition. In other embodiments, a gel comprises adiscontinuous phase firmed from a PCM. A phase comprising a PCM, in someembodiments, can be a liquid phase or a solid phase. In addition, insome embodiments, a gel comprises a solid phase formed from ahydrophobic sorption material of the composition. The solid phase, insome embodiments, is a continuous phase. Further, in some embodiments, agel does not comprise water or is substantially free of water. Forreference purposes herein, a substance that is substantially free ofwater comprises less than about 10 weight percent, less than about 5weight percent, less than about 1 weight percent, or less than about 0.1weight percent water, based on the total weight of the substance.

In addition, in some embodiments, a composition described hereincomprises or more additives. In some embodiments, an additive providesone or more properties to a composition described herein, For instance,in some embodiments, an additive comprises a thermal conductivitymodulator. A thermal conductivity modulator, in some embodiments, isoperable to alter or modulate the thermal conductivity of a compositiondescribed herein. In some embodiments, an additive comprises anantimicrobial material and/or a fire retardant. Moreover, in someembodiments, an additive does not comprise water. In some embodiments, acomposition described herein is free or substantially free of water.

Turning now to specific components of compositions, compositionsdescribed herein comprise one or more phase change materials (PCMs). AnyPCM not inconsistent With the objectives of the, present invention maybe used. In some embodiments, for instance, a PCM comprises a fattyacid. A fatty acid, in some embodiments, can have a C4 to C28 aliphatichydrocarbon tail. Further, in some embodiments, the hydrocarbon tail issaturated. Alternatively, in other embodiments, the hydrocarbon tail isunsaturated. In some embodiments, the hydrocarbon tail can be branchedor linear. Non-limiting examples of fatty acids suitable for use in someembodiments described herein include caprylic acid, capric acid, lauricacid, myristic acid, palmitic acid, stearic acid, arachidic acid,behenic acid, lignoceric acid, and cerotic acid. In some embodiments,PCM described herein comprises a plurality of differing fatty acids.

In some embodiments, a PCM comprises an alkyl ester of a fatty acid. Anyalkyl ester not inconsistent with the objectives of the presentinvention may be used. For instance, in some embodiments, an alkyl estercomprises a methyl, ethyl, propyl, or butyl ester of a fatty aciddescribed herein. In other embodiments, an alkyl ester comprises a C2 toC6 ester alkyl backbone or a C6 to C12 ester alkyl backbone. In someembodiments, an alkyl ester comprises a C12 to C28 ester alkyl backbone.Further, in some embodiments, an oxidized fatty component describedherein comprises a plurality of differing alkyl esters of fatty acids.Non-limiting examples of alkyl esters of fatty acids suitable for use insome embodiments described herein include methyl laurate, methylmyristate, methyl palmitate, methyl stearate, methyl palmitoleate,methyl oleate, methyl linoleate, methyl docosahexanoate, and methylecosapentanoate. In some embodiments, the corresponding ethyl, propyl,or butyl esters may also be used.

In some embodiments, PCM comprises a fatty alcohol. Any fatty alcoholnot inconsistent with the objectives of the present invention may beused. For instance, a fatty alcohol, in some embodiments, can have a C4to C28 aliphatic hydrocarbon tail. Further, in some embodiments, thehydrocarbon tail is saturated. Alternatively, in other embodiments, thehydrocarbon tail is unsaturated. In some embodiments, the hydrocarbontail can be branched or linear. Non-limiting examples of fatty alcoholssuitable for use in some embodiments described herein include caprylalcohol, pelargonic alcohol, capric alcohol, underyl alcohol, laurylalcohol, tridecyl alcohol, myristyl alcohol, pentadecyl alcohol, cetylalcohol, heptadecyl alcohol, stearyl alcohol, nonadecyl alcohol,arachidyl alcohol, heneicosyl alcohol, behenyl alcohol, lignocerylalcohol, ceryl alcohol, and montanyl alcohol. In some embodiments, a PCMcomprises a plurality of differing fatty alcohols.

In some embodiments, a PCM comprises a fatty sulfonate or phosphonate.Any fatty sulfonate or phosphonate not inconsistent with the objectivesof the present invention may be used. In some embodiments, a PCMcomprises a C4 to C28 alkyl sulfonate or phosphonate. In someembodiments, a PCM comprises a C4 to C28 alkenyl sulfonate orphosphonate. Further, in some embodiments, a PCM comprises apolyethylene glycol. Any polyethylene glycol not inconsistent with theobjectives of the present invention may be used.

In some embodiments, a composition described herein comprises aplurality of differing PCMs. Any combination of differing PCMs notinconsistent with the objectives of the present invention may be used.In some embodiments, for example, a composition comprises one or morefatty acids and one or more fatty alcohols. Moreover, in someembodiments of compositions comprising a plurality of PCMs, theplurality of PCMs comprises between about 1 and about 99 weight percentfatty acid based on the total weight of the plurality of PCMs. In someembodiments, the plurality comprises between about 10 and about 90weight percent, between about 20 and about 80 weight percent, betweenabout 30 and about 70 weight percent, or between about 50 and about 90weight percent fatty acid. In some embodiments, a plurality of PCMscomprises between about 1 and about 99 weight percent alkyl ester of afatty acid. In some embodiments, the plurality comprises between about10 and about 90 weight percent, between about 20 and about 80 weightpercent, between about 30 and about 70 weight percent, or between about50 and about 90 weight percent alkyl ester of a fatty acid. Further, insome embodiments, a plurality of PCMs comprises between about 1 andabout 99 weight percent fatty alcohol. In some embodiments, theplurality comprises between about 10 and about 90 weight percent.between about 20 and about 80 weight percent, between about 30 and about70 weight percent, between about 5 and about 50 weight percent, orbetween about 5 and about 25 weight percent fatty alcohol.

Further, in some embodiments, a plurality of differing PCMs is selectedbased on a desired viscosity and/or latent heat of the composition. Insome embodiments, a plurality of differing PCMs is selected based on adesired phase transition temperature of a composition. A phasetransition temperature, in some embodiments, is between about −50° C.and about 100° C. at 1 atm or between about −40° C. and about 40° C. at1 atm. In some embodiments, a phase transition temperature is betweenabout −50° C. and about 0° C. at 1 atm or between about −20° C. andabout 0° C. at 1 atm. In some embodiments, a phase transitiontemperature is between about 0° C. and about 70° C. at 1 atm or betweenabout −4° C. and about 40° C. at 1 atm. In other embodiments, a phasetransition temperature: is between about 30° C. and about 50° C. at 1atm or between about 35° C. and about 45° C. at 1 atm.

In addition, a PCM or a plurality of PCMs described herein can bepresent in a composition in any amount not inconsistent with theobjectives of the present invention. In some embodiments, for example, acomposition comprises between about 50 and about 99 weight percent PCMbased on the total weight of the composition. In some embodiments, acomposition comprises between about 70 and about 90 weight percent,between about 75 and about 85 weight percent, between about 85 and about95 weight percent, or between about 90 and about 99 weight percent PCM.

Compositions described herein also comprise one or more hydrophobicsorption materials. Any hydrophobic sorption material not inconsistentwith the objectives of the present invention may be used, in someembodiments, for instance, a hydrophobic sorption material comprises anaerogel. An aerogel, in some embodiments, comprises an organiccomposition, such as agar. In some embodiments, an aerogel comprisescarbon. In some embodiments, an aerogel comprises alumina. In someembodiments, an aerogel comprises silica, including fumed silica.Moreover, an aerogel comprising fumed silica, in some embodiments,comprises particles having a size from about 1 μm to about 10 mm. Insome embodiments, the particles have a size from about 1 μm to about 100μm, from about 1 μm to about 10 μm, or from about 5 μm to about 10 μm.Further, in some embodiments, an aerogel has high porosity. Forinstance, in some embodiments, an aerogel comprises over 90 percent air.In addition, in some embodiments, an aerogel comprises pores having asize between about 1 nm and about 100 nm. In some embodiments, the poreshave a size between about 10 am and about 100 nm or between about 20 nmand about 40 nm. Moreover, an aerogel described herein, in someembodiments, has a high surface area, such as a surface area of about500 m²/g or more. In some embodiments, an aerogel has a surface areabetween about 500 m²/g and about 1000 m²/g, or between about 600 m²/gand about 900 m²/g. In addition, in some embodiments, an aerogel has alow tap density. In some embodiments, for instance, an aerogel has a tapdensity less than about 500 kg/m³ or less than about 100 kg/m³. In someembodiments, an aerogel has a tap density between about 1 kg/m³ andabout 200 kg/m³, between about 10 kg/m³ and about 100 kg/m³. Further, insome embodiments, an aerogel described herein has a low thermalconductivity. In some embodiments, an aerogel has a thermal conductivityless than about 50 mW/mK or less than about 20 mW/mK. In someembodiments, an aerogel has a thermal conductivity between about 1 mW/mKand about 20 mW/mK or between about 5 mW/mK and about 15 mW/mK.Moreover, in some embodiments, an aerogel has a hydrophobic surface. Inaddition, in some embodiments, an aerogel has a high oil absorptioncapacity (DBP). In some embodiments, an aerogel has an oil absorptioncapacity greater than about 100 g/100 g. In some embodiments, an aerogelhas an oil absorption capacity greater than about 500 g/100 g. In someembodiments, an aerogel has an oil absorption capacity between about 100000 g and about 1000 g/100 g, between about 300 g/100 g and about 800g/100 g, or between about 400 g/100 g and about 600 g/100 g. Further, insome embodiments, an aerogel has a specific heat capacity between about0.1 kJ/(kg K) and about 5 kJ/(kg K). In some embodiments, an aerogel hasa specific heat capacity between about 0.5 kJ/(kg K) and about 1.5kJ/(kg K).

In other embodiments, a hydrophobic sorption material comprises apolymeric material. Any polymeric material not inconsistent with theobjectives of the present invention may be used. In some embodiments, apolymeric material comprises an organic composition. For example, insome embodiments, a polymeric material comprises a polyolefin such aspolyethylene or polypropylene, a polycarbonate, a polyester, or apolyurethane. In some embodiments, a polymeric material comprisespolyvinyl alcohol (PVA). In some embodiments, a polymeric materialcomprises acrylonitrile, including a polyacrylonitrile or acrylonitrilecopolymer. An acrylonitrile copolymer, in some embodiments, comprisesstyrene-acrylonitrile (SAN), acrylonitrile styrene acrylate (ASA)acrylonitrile butadiene (NBR), acrylonitrile butadiene styrene (ABS). Insome embodiments, a composition comprise: a particulate polymericmaterial, such as ABS grains.

In some embodiments, a polymeric material comprises a styrene blockcopolymer (SBC). A styrene block copolymer, in some embodiments,comprises a linear triblock copolymer. The linear triblock copolymer, insome embodiments, comprises an A-B-A structure, where the A blockscomprise polystyrene and the B block comprises an elastomer In someembodiments, an SBC comprises between about 20 percent and about 40percent polystyrene. In some embodiments, an SBC comprises between about25 percent and about 35 percent polystyrene. Further, in someembodiments, a SBC can be maleated or unmaleated, Moreover, in someembodiments, an SBC, has an average molecular weight greater than about75,000. In some embodiments, an SBC has an average molecular weightgreater than about 200,000. In some embodiments, an SBC has an averagemolecular weight between about 75,000 and about 1,000,000, between about75,000 and about 500,000, or between about 100,000 and about 300,000.For reference purposes herein, molecular weight comprises weight averagemolecular weight. In addition, in some embodiments, an SBC has aspecific gravity less than about 1. In some embodiments, an SBC has aShore A hardness between about 50 and about 100. In some embodiments, anSBC has a Shore A hardness between about 50 and about 75 or betweenabout 55 and about 70, Non-limiting examples of SBCs useful in someembodiments described herein include styrene-ethylene-butylene-styrene,styrene-ethylene-propylene-styrene,styrene-ethylene-ethylene/propylene-styrene,styrene-isobutylene-styrene, styrene-butadiene-styrene,styrene-isoprene-styrene, and combinations thereof. Commerciallyavailable SBCs useful in some embodiments described herein include SBCsprovided by Kraton Polymers (Houston, Tex.), such as Kraton G1651HU,Kraton G1650, Kraton G1652, and Kraton G1654H.

In some embodiments, a polymeric material comprises a biopolymer. Forinstance, in some embodiments, a polymeric material comprises celluloseor a cellulosic material or cellulose derivative. In some embodiments, apolymeric material comprises hydroxymethyl cellulose (HMC), hydroxyethylcellulose (HEC), hydroxypropyl cellulose (HPC), hydroxypropylmethylcellulose (UPMC), hydroxypropyl methylcellulose phthalic ester (HPMCP),methyl cellulose (MC), ethyl cellulose (EC), carboxymethylcellulose(CMC), and/or polyanionic cellulose (PAC). In some embodiments, acellulosic material or cellulose derivative has a molecular weightbetween about 100,000 and about 2,000,000, In some embodiments, acellulosic material or cellulosic derivative has a molecular weightbetween about 250,000 and about 1,500,000, between about 250,000 andabout 450,000, between about 750,000 and about 950,000, or between about1,000,000 and about 1,300,000. Further, in some embodiments, a polymericmaterial comprises chitosan. In some embodiments, the chitosan has amolecular weight between about 3000 and 20,000. Further, in someembodiments, the chitosan has a degree of deacetylation between about 50percent and about 100 percent.

In some embodiments, a hydrophobic sorption material comprises aninorganic composition. For example, in some embodiments, a hydrophobicsorption material comprises a zeolite. Any zeolite not inconsistent withthe objectives of the present invention may be used. In someembodiments, a zeolite comprises a natural zeolite. In otherembodiments, a zeolite comprises an artificial zeolite. In someembodiments, a zeolite comprises a silicate and/or aluminosilicate. Insome embodiments, a zeolite comprises a composition according to theformula M_(x/n) [AlO₂)_(x)(SiO₂)_(y)]⋅w H₂O, where n is the valence ofcation M (e.g., Na⁺, K⁺, Ca²⁺, or Mg²⁺), w is the number of watermolecules per unit cell, and x and y are the total number of tetrahedralatoms per unit cell. Non-limiting examples of zeolites suitable for usein some embodiments described herein include analcime((K,Ca,Na)AlSi₂O₆⋅H₂O), chabazite ((Ca,Na₂,K₂,Mg)Al₂Si₄O₁₂⋅6H₂O),clinoptilolite ((Na,K,Ca)₂₋₃Al₃(Al₃(Al, Si)₂Si₁₃O₃₆⋅12H₂), heulandite((C,Na)₂₋₃Al₃(Al,Si)₂Si₁₃O₃₆⋅12H₂O), natrolite (Na₂Al₂Si₃O₁₀⋅2H₂O),phillipsite ((Ca,Na₂,K)₃Al₆Si₁₀O₃₂⋅12H₂), and stilbite(NaCa₄(Si₂₇Al₉)O₇₂⋅28(H₂O)).

Further, in some embodiments, a composition described herein comprises aplurality of differing hydrophobic sorption materials. Any combinationof differing hydrophobic sorption materials not inconsistent with theobjectives of the present invention may be used. For instance, in someembodiments, a composition comprises an aerogel and a polymericmaterial. In some embodiments, a composition comprises one or moreaerogels, one or more polymeric materials, and/or one or more zeolites.Further, in some embodiments, a plurality of differing hydrophobicsorption materials of a composition is selected based on a desiredviscosity of the composition.

In addition, a hydrophobic sorption material described herein can bepresent in a composition in any amount not inconsistent with theobjectives of the present invention. In some embodiments, for instance,a composition described herein comprises less than about 20 weightpercent hydrophobic sorption material based on the total weight of thecomposition. In some embodiments, a composition comprises less thanabout 10 weight percent, less than about 5 weight percent, less thanabout 3 weight percent, less than about 2 weight percent, or less thanabout 1 weight percent hydrophobic sorption material. In someembodiments, a composition comprises between about 1 weight percent andabout 20 weight percent, between about 1 weight percent and about 10weight percent, between about 1 weight percent and about 5 weightpercent, or between about 5 weight percent and about 10 weight percenthydrophobic sorption material.

Compositions described herein also comprise one or more viscositymodifiers. Any viscosity modifier not inconsistent with the objectivesof the present invention may be used. In some embodiments, a viscositymodifier comprises an ionic liquid. Any ionic liquid not inconsistentwith the objectives of the present invention may be used. In someembodiments, for instance, an ionic liquid is imidazoliurn-based. Inother embodiments, an ionic liquid is pyridinium-based. In someembodiments, an ionic liquid is choline-based. Further, in someembodiments, an ionic liquid comprises a sugar, sugar alcohol, or sugarderivative, such as glycol-choline, glycerol-choline,erythritol-choline, threitol-choline, arabitol-choline, xylitol-choline,ribitol-choline, mannitol-choline, sorbitol-choline, dulcitol-choline,iditol-choline, isomalt-choline, maltitol-choline, or lactitol-choline.Non-limiting examples of ionic liquids suitable for use in someembodiments described herein include 1-Allyl-3-methylimidazoliumbis(trifluoromethylsulfonyl)imide, 1-Allyl-3-methylimidazolium bromide,1-Allyl-3-methylimidazolium dicyanamide, 1-Allyl-3-methylimidazoliumiodide, 1-Benzyl-3-methylimidazolium chloride,1-Benzyl-3-methylimidazolium hexafluorophosphate,1-Benzyl-3-methylimidazolium tetrafluoroborate,1,3-Bis(3-cyanopropylyimidazolium bis(trifluoromethylsulfonyl)imide,1,3-Bis(3-cyanopropyl)imidazolium chloride,1-Butyl-2,3-dimethylimidazolium hexafluorophosphate,1-Butyl-2,3-dimethylimidazolium tetrafluoroborate,4(3-Butyl-1-imidazolio)-1-butanesulfonate, 1-Butyl-3-methylimidazoliumacetate, 1-Butyl-3-methylimidazolium chloride,1-Butyl-3-methylimidazolium dibutyl phosphate,1-Butyl-3-methylimidazolium hexafluorophosphate,1-Butyl-3-methylimidazolium nitrate, 1-Butyl-3-methylimidazolium cetylsulfate, 1-Butyl-3-methylimidazolium tetrachloroaluminate,1-Butyl-methylimidazolium tetrafluoroborate, 1-Butyl-3-methylimidazoliumthiocyanate, 1-Butyl-3-methylimidazolium tosylate,1-Butyl-3-methylimidazolium trifluoroacetate.1-Butyl-3-methylimidazolium trifluoromethanesulfonate,1-(3-Cyanopropyl)-3-methylimidazolium bis(trifluoromethylsulfonyl)amide,1-Decyl-3-methylimidazolium tetrafluoroborate, 1,3-Diethoxylmidazoliumbis(trifluoromethylsulfonyl)imide, 1,3-Diethoxyimidazoliumhexafluorophosphate 1,3-Dihydroxyimidazoliumbi(trifluoromethylsulfonyl)imide, 1,3-Dihydroxy-2-methylimidazoliumbis(trifluoromethylsulfonyl)imide, 1,3-Dimethoxy-2-methylimidazoliumhexafluorophosphate, 1-Dodecyl-3-methylimidazolium iodide,1-Ethyl-2,3-dimethylimidazolium tetrafluoroborate,1-Ethyl-3-methylimidazolium hexafluorophosphate,1-Ethyl-3-methylimidazolium L-(+)-lactate, 1-Ethyl-3-methylimidazolium1,1,2,2-tetrafluoroethanesulfonate, 1-Hexyl-3-methylimidazoliumbis(trifluormethylsulfonyl)imide, 1-Hexyl-3-methylimidazolium chloride,1-Hexyl-3-methylimidazolium hexafluorophosphate, 1-Methylimidazoliumchloride, 1-Methyl-3-octylimidazolium chloride,1-Methyl-3-octylimidazolium tetrafluoroborate,1-Methyl-3-propylimidazolium iodide,1-Methyl-3-(3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl)imidazoliumhexafluorophosphate, 1,2,3-methylimidazolium methyl sulfate,1-Butyl-4-methylpyridinium chloride 1-Butyl-4-methylpyridiniumhexafluorophosphate, 1-Butylpyridinium bromide,1-(3-Cyanopropyl)pyridinium chloride, 1-Ethylpyridiniumtetrafluoroborate, 3-Methyl-1-propylpyridiniumbis(trifluormethylsulfonyl)imide, and Cholin acetate, all availablecommercially from Sigma-Aldrich.

In other embodiments, a viscosity modifier comprises a diisocyanate. Anydiisocyanate not inconsistent with the objectives of the presentinvention may be used. In some embodiments, a diisocyanate. comprises amethylene diphenyl diisocyanate (MDI). In some embodiments, adiisocyanate comprises a toluene diisocyanate (TDI), naphthalenediisocyanate (SDI), isophorone diisocyanate (IPDI), and/or hexamethylenediisocyanate (HDI). Non-limiting examples of diisocyanates suitable foruse in some embodiments described herein include Lupranate® LP27, LP30,LP30D, M, MI, MS, M10, M20, M20S, M2OFB, M2OSHB, M20SB, M70L, MM103,MM102, MS, R2500, R2500U, T80-Type 1, T80-Type 2, TF2115, 78, 81, 219,223, 227, 230, 234, 245, 259, 265, 266, 273, 275, 278, 280, 281, 5010,5020, 5030, 5040, 5050, 5060, 5070, 5080, 5090, 5100, 5110, 5140, 5143,and 8020, all commercially available from BASF. Other non-limitingexamples of diisocyanates suitable for use in some embodiments describedherein include Suprasec®, 2004, 2029, 5025, 7316, 7507, 9150, 9561,9577, 9582, 9600, 9603, 9608, 9612, 9610, 9612, 9615, and 9616 as wellas Rubinate® 1209, 1234, 1670, 1790, 1920, 9040, 9234, 9236, 9271, 9272,9465, and 9511, all commercially available from Huntsman. Other majorproducers of diisocyanates include Bayer, BorsodChem, Dow, Mitsui,Nippon Polyurethane Industry and Yantai Wanhua.

Further, in some embodiments, a composition described herein comprises aplurality of differing viscosity modifiers. Any combination of differingviscosity modifiers not inconsistent with the objectives of the presentinvention may be used. In some embodiments, a plurality of differingviscosity modifiers is selected based on a desired consistency orviscosity of a composition described herein.

In addition, a viscosity modifier described herein can be present in acomposition in any amount not inconsistent with the objectives, of thepresent invention. In some embodiments, for instance, a compositiondescribed herein comprises less than about 10 weight percent viscositymodifier based on the total weight of the composition. In someembodiments, a composition comprises less than about 5 weight percent,less than about 3 weight percent, less than about 2 weight percent, orless than about 1 weight percent viscosity modifier. In someembodiments, a composition comprises between about 1 weight percent andabout 5 weight percent or between about 1 weight percent and about 3weight percent viscosity modifier.

A composition described herein, in some embodiments, further comprisesone or more linker components. In some embodiments, a linker componentis chemically bonded to a PCM of the composition, Further, in someembodiments, a linker component chemically bonded to a PCM provides anon-polymeric material. In some embodiments, a linker componentchemically bonded to a PCM provides an oligomeric material. In someembodiments, for example, a PCM is monofunctional. A monofunctional PCM,in some embodiments, can be chemically bonded to a linker componentthrough a single functional group, such as a carboxyl or hydroxyl group.Further, in some embodiments, a linker component is polyfunctional. Apolyfunctional linker component, in some embodiments, can be chemicallybonded to more than one PCM, including more than one monofunctional PCM.For example, in some embodiments, a bifunctional linker component (B)can be chemically bonded to two monofunctional PCMs (A) to provide anA-B-A trimer. In other embodiments, a bifunctional linker component ischemically bonded to one monofunctional PCM to provide an A-B dimer.Moreover, in some embodiments, a linker, component described is alsooperative as a viscosity modifier described herein.

Further, a linker component can be chemically bonded to a PCM throughany chemical bond not inconsistent with the objectives of the presentinvention. In some embodiments, for instance, a linker component ischemically bonded to a PCM through a covalent bond. In otherembodiments, a linker component is chemically bonded to a PCM through anionic bond or electrostatic bond. In some embodiments, a linkercomponent is chemically bonded to a PCM through a hydrogen bond. In someembodiments, a linker component is chemically bonded to a PCM through aurethane bond. In other embodiments, a linker component is chemicallybonded to a PCM through an amide bond. In some embodiments, a linkercomponent is chemically bonded to a PCM through an ester bond.

In addition, a linker component described herein can comprise anychemical species not inconsistent with the objectives of the presentinvention. In some embodiments, for instance, a linker componentcomprises a functional group capable of forming a covalent bond with afunctional group of a PCM described herein, such as a carboxyl group ora hydroxyl group. In some embodiments, a linker component comprises apolyol. In some embodiments, a linker component comprises a saccharide,including a monosaccharide, disaccharide, oligosaccharide, orpolysaccharide. A polysaccharide, in some embodiments, comprisescellulose or a cellulose derivative. Further, in some embodiments, alinker component comprises a sugar alcohol, such as glycol, glycerol,erythritol, threitol, arabitol, xylitol, ribitol, mannitol, sorbitol,dulcitol, iditol, isomalt, maltitol, or lactitol.

In other embodiments, a linker component comprises an isocyanate. Insome embodiments, a linker component comprises a diisocyanate, such as amethylene diphenyl diisocyanate (MDI), toluene diisocyanate (TDI),naphthalene diisocyanate (NDI), isophorone dilsocyanate (IPDI), and/orhexamethylene diisocyanate (HDI). Non-limiting examples of diisocyanatessuitable for use in some embodiments described herein include Lupranate®LP27, LP30, LP30D, M, MI, MS, M10, M20, M20S, M20FB, M20HB, M20SB, M70L,MM103, MP102, MS, R2500, R2500U, T80-Type 1, T80-Type 2, TF2115, 78, 81,219, 223, 227, 230, 234, 245, 259, 265, 266, 273, 275, 278, 280, 281,5010, 5020, 5030, 5040, 5050, 5060, 5070, 5080, 5090, 5100, 5110, 5140,5143, and 8020, all commercially available from BASF. Other non-limitingexamples of diisocyanates suitable for use in some embodiments describedherein include Suprasec® 2004, 2029, 5025, 7316, 7507, 9150, 9561, 9577,9582, 9600, 9603, 9608, 9612, 9610, 9612, 9615, and 9616 as Well asRubinate® 1209, 1234, 1670, 1790, 1920, 9040, 9234, 9236, 9271, 9272,9465, and 9511, all commercially available from Huntsman, Other majorproducers of diisocyanates include Bayer, BorsodChem, Dow, Mitsui,Nippon Polyurethane Industry and Yantai Wanhua.

Further, in some embodiments, a composition described herein comprises aplurality of differing linker components, Any combination of differinglinker components not inconsistent with the objectives of the presentinvention may be used. In some embodiments, a plurality of differinglinker components is selected based on a desired viscosity of acomposition.

In addition, a linker component described herein can be present in acomposition in any amount not inconsistent with the objectives of thepresent invention. In some embodiments, for instance, a compositioncomprises less than about 10 weight percent linker component based onthe total weight of the composition. In some, embodiments, a compositioncomprises less, than about 5 weight percent, less than about 3 weightpercent, less than about 2 weight percent, or less than about 1 weightpercent linker component. In some embodiments, a composition comprisesbetween about 1 weight percent and about 5 weight percent linkercomponent or between about 1 weight percent about 8 weight percentlinker component. Further, in some embodiments, a composition comprisesless linker component than PCM, For example, in some embodiments, theratio of PCM to linker component is greater than about 2:1, greater thanabout 5:1, greater than about 10:1, greater than about 20:1, or greaterthan about 40:1 by weight. In some embodiments, the ratio of PCM tolinker component is between about 2:1 and about 50:1 or between about5:1 and about 30:1.

A composition described herein, in some embodiments further comprisesone or more additives. Any additive not inconsistent with the objectivesof the present invention may be used. In some embodiments, for instance,an additive comprises a thermal conductivity modulator. A thermalconductivity modulator, in some embodiments, comprises carbon, includinggraphitic carbon. In some embodiments, a thermal conductivity modulatorcomprises carbon black and/or carbon nanoparticles Carbon nanoparticles,in some embodiments, comprise carbon nanotubes and/or fullerenes. Insome embodiments, a thermal conductivity modulator comprises a graphiticmatrix structure. In other embodiments, a thermal conductivity modulatorcomprises an ionic liquid. In some embodiments, a thermal conductivitymodulator comprises a metal, including pure metals and alloys. Any metalnot inconsistent with the objectives of the present invention may beused. In some embodiments, a metal comprises a transition metal, such assilver or copper. In some embodiments, a metal comprises an element fromGroup 13 or Group 14 of the periodic table. In some embodiments, a metalcomprises aluminum. In some embodiments, a thermal conductivitymodulator comprises a metallic filler, a metal matrix structure, a metaltube, a metal plate, and/or metal shavings. Further, in someembodiments, a thermal conductivity modulator comprises a metal oxide.Any metal oxide not inconsistent with the objectives of the presentinvention may be used. In some embodiments, a metal oxide comprises atransition metal oxide. In some embodiments, a metal oxide comprisesalumina.

In some embodiments, an additive comprises an antimicrobial material.Any antimicrobial material, not inconsistent with the objectives of thepresent invention may be used. An antimicrobial material, in someembodiments, comprises an inorganic composition, including metals and/ormetal salts. In some embodiments, for example, an antimicrobial materialcomprises metallic copper, zinc, or silver or a salt of copper, zinc, orsilver. Moreover, in some embodiments, an antimicrobial materialcomprising a metal can also provide thermal conductivity modulation. Inother embodiments, an antimicrobial material comprises an organiccomposition, including natural and synthetic organic compositions. Insome embodiments, an antimicrobial material comprises a β-lactam such asa penicillin or cephalosporin. In some embodiments, an antimicrobialmaterial comprises a protein synthesis inhibitor such as neomycin. Insome embodiments, an antimicrobial material comprises an organic acid,such as lactic acid, acetic acid, or citric acid. In some embodiments,an antimicrobial material comprises a quarternary ammonium species. Aquarternary ammonium species, in some embodiments, comprises a longalkyl chain, such as an alkyl chain having a C8 to C28 backbone. In someembodiments, an antimicrobial material comprises one or more ofbenzalkonium chloride, benzethonium chloride, methylbenzethoniumchloride, cetalkonium chloride, cetylpyridinium chloride, cetrimonium,cetrimide, dofanium chloride, tetraethylammonium bromide,didecyldimethylammonium chloride, and domiphen bromide.

In some embodiments, an additive comprises a fire retardant. Any fireretardant not inconsistent with the objectives of the present inventionmay be used. In some embodiments, a fire retardant comprises a foam orgel. Further, in some embodiments, a fire retardant can comprise anorganic composition or an inorganic composition. In some embodiments, afire retardant comprises tris(2-chloro-1(chloromethyl)ethyl)phosphate.In some embodiments, a fire retardant comprises aluminum hydroxideand/or magnesium hydroxide. In some embodiments, a fire retardantcomprises a zeolite, including a zeolite described herein.

Moreover, a composition described herein can comprise any combination ofPCMs, hydrophobic sorption materials, viscosity modifiers, linkercomponents, and/or additives not inconsistent with the objectives of thepresent invention.

In addition, a composition described herein, in some embodiment,exhibits desirable latent heat storage properties. In some embodiments,for instance, a composition described herein has a latent heat of atleast about 100 J/g. In some embodiments, a composition has a latentheat, of at least about 150 J/g, in some embodiments, a composition hasa latent heat of at least about 180 J/g. In some embodiments, acomposition has a latent heat of at least about 200 J/g. In someembodiments, a composition has a latent heat of at least about 220 J/g,at least about 230 kg, or at least about 250 J/g. In some embodiments, acomposition has a latent heat between about 100 J/g and about 300 J/g.In some embodiments, a composition has a latent heat between about 150J/g and about 250 J/g, between about 150 J/g and about 220 J/g, betweenabout 150 J/g and about 200 J/g, between about 180 J/g and about 250J/g, or between about 180 J/g and about 220 J/g. Further, the latentheat of a composition described herein is associated with a transitionbetween two condensed phases or states of the composition, such as atransition between a solid phase and a liquid phase, between a solidphase and a mesophase, or between two solid states. A mesophase, in someembodiments, comprises a phase intermediate between a solid phase and aliquid phase. In addition, it is contemplated herein that, in someembodiments, a composition may have more than one latent heat associatedwith a transition between two condensed phases or states, such as afirst latent heat associated with a crystalline solid-amorphous solidtransition and a second latent heat associated with a solid-liquidtransition. In some embodiments comprising a composition having morethan one latent heat associated with a transition between two condensedphases, one of the latent heats has a value described hereinabove. Inother embodiments, a plurality or all of the latent heats have a valuedescribed hereinabove.

Moreover, in some embodiments, a composition described herein has alatent heat substantially equal to or greater than a latent heat of aPCM of the composition. In some embodiments, a composition has a latentheat of at least about 80 percent of a latent heat of a PCM of thecomposition. In some embodiments, a composition has a latent heat of atleast about 90 percent or at least about 95 percent of a latent heat ofa PCM of the composition. In some embodiments, a composition has alatent heat greater than a latent heat of a PCM of the composition.

Further, in some embodiments, a composition described herein exhibitsother desirable properties for latent heat storage applications. forexample, in some embodiments, a composition is non-flammable orsubstantially non-flammable. For reference purposes herein, anon-flammable or substantially non-flammable composition has a rating ofA1, A2, or B1 when measured according to DIN 4102. Moreover, in someembodiments, a composition described herein has a viscosity betweenabout 200 cP and about 20,000 cP, between about 200 cP and about 10,000cP, between about 1000 cP and about 15,000 cP, or between about 1000 cPand about 5000 cP measured according to ASTM standard D2983. In someembodiments, a composition has a viscosity between about 200 cP andabout 50,000 cP at a temperature between about 20° C. and about 70° C.at 1 atm. In some embodiments, a composition has a viscosity betweenabout 200 cP and about 25,000 cP, between about 200 cP and about 10,000cP, or between about 1000 cP and about 5000 cP at a temperature betweenabout 20° C. and about 70° C. at 1 atm. In some embodiments, acomposition does not readily flow without the application of an externalforce or pressure, permitting the use of the composition in variousapplications requiring little or no flow. In some embodiments, acomposition is self-supporting or non-encapsulated. Therefore, in someembodiments, compositions described herein can be used in variousconstruction and engineering applications without the need formicroencapsulation.

Moreover, in some embodiments, a composition has a viscosity betweenabout 5000 cP and about 20,000 cP at a temperature between about −40° C.and about 40° C. at 1 atm or between about −30° C. and about 30° C. at 1atm. In some embodiments, a composition has a viscosity between about5000 cP and about 20,000 cP at a temperature between about −50° C. andabout 0° C. at 1 atm or between about −20° C. and about 0° C. at 1 atm.In other embodiments, a composition has a viscosity between about 5000cP and about 20,000 cP at a temperature between about 30° C. and about50° C. at 1 atm or between about 35° C. and about 45° C. at 1 atm,Therefore, in some embodiments, a composition described herein canexhibit desirable properties in hot and/or cold environments.

II. Methods of Making a Composition Comprising a Phase Change Material

In another aspect, methods of making a composition comprising a phasechange material are described herein. In some embodiments, a method ofmaking a composition comprises providing a PCM, providing a hydrophobicsorption material, providing a viscosity modifier, and combining thePCM, hydrophobic sorption material, and viscosity modifier. In someembodiments, the hydrophobic sorption material and the viscositymodifier do not comprise the same material. In some embodiments, amethod further comprises providing a linker component having a chemicalfunctional group capable of forming a chemical bond with the PCM andcombining the linker component with the PCM, hydrophobic sorptionmaterial, and viscosity modifier. In some embodiments, a method furthercomprises providing one or more additives and combining the one or moreadditives with the PCM, hydrophobic sorption material, and viscositymodifier. In some embodiments, a method described herein comprisesproviding a plurality of differing PCMs, hydrophobic sorption materials,viscosity modifiers, linker components, an for additives. Moreover, insome embodiments, a PCM, hydrophobic sorption material, viscositymodifier, linker component, and/or additive can comprise any PCM,hydrophobic sorption material, viscosity modifier, linker component,and/or additive described hereinabove in Section I. In addition, in someembodiments, a method does not comprise providing water.

Further, combining a PCM, hydrophobic sorption material, and viscositymodifier, in some embodiments, comprises absorbing and/or adsorbing aPCM with a hydrophobic sorption material as described, for example, inSection I hereinabove. Moreover, combining can be carried out in anymanner not inconsistent with the objectives of the present invention. Insome embodiments, for instance, combining comprises mixing or stirring,including at a temperature greater than room temperature and/or greaterthan the melting point of one or more components of a compositiondescribed herein. In addition, in some embodiments, combining the PCM,hydrophobic sorption material, and viscosity modifier comprises firstcombining the PCM and the hydrophobic absorption material and thenadding the viscosity modifier. Alternatively, in other embodiments,combining the PCM, hydrophobic sorption material, and viscosity modifiercomprises first combining the PCM and the viscosity modifier and thenadding the hydrophobic sorption material.

In addition, in some embodiments, a method described herein furthercomprises forming a gel. In some embodiments, forming a gel comprisespartially encapsulating a PCM a hydrophobic sorption material. Moreover,in some embodiments, forming a gel does not comprise providing water,For example, in some embodiments, forming a gel comprises providing acellulosic material or cellulose derivative but does not compriseproviding water. In other embodiments, forming a gel comprises formingone or more chemical bonds between a PCM and a linker component. The oneor more chemical bonds can comprise any chemical bond between a PCM andlinker component described hereinabove in Section I, including aurethane bond, amide bond, or ester bond. In addition, in someembodiments, forming one or more chemical bonds comprises providing acatalyst. Any catalyst not inconsistent with the objectives of the,present invention may be used. In some embodiments, a catalyst isselected based on the identity of one or more of a desired chemicalbond, a solvent, a PCM, and a linker component. In some embodiments, acatalyst comprises a tertiary amine, such as triethylamine ortriethanolamine. In other embodiments, a catalyst comprises anorganometallic complex. In some embodiments, a catalyst comprises ametal complex comprising mercury, lead, tin, bismuth or zinc, includingorganometallic complexes. In some embodiments, a catalyst comprises adibutyltin, such as dibutyltin laurate. Moreover, in some embodiments, acatalyst is provided in an amount less than about 0.1 weight percent. Insome embodiments, a catalyst is provided in an amount between about0.001 and about 0.1 weight percent.

A composition made by a method described herein, in some embodiments,can comprise a composition described hereinabove in Section Further, insome embodiments, a composition can comprise any component and/or haveany property of a composition described hereinabove in Section I. Forexample, in some embodiments, a composition made by a method describedherein is non-flammable or substantially non-flammable. In someembodiments, a composition made by a method described herein has aviscosity between about 5000 cP and about 20,000 cP and/or has acondensed phase latent heat between about 100 J/g and about 300 J/g. Insome embodiments, a composition made by a method described herein isfree or substantially free of water.

III. Methods of Making a Foam

In another aspect, methods of making a loam are described herein. Insome embodiments, a method of making a foam comprises combining a phasechange material (PCM with a hydrophobic sorption material to provide afirst mixture, combining, a polyfunctional monomer with a linkercomponent to provide a second mixture, and combining the first mixturewith the second mixture. In some embodiments, combining a PCM with ahydrophobic sorption material comprises at least partially absorbing oradsorbing the PCM with the hydrophobic sorption material. For example,in some embodiments, a PCM comprises an absorbate and a hydrophobicsorption material comprises an absorbent. In other embodiments, a PCMcomprises an adsorbate of the hydrophobic sorption material. Moreover,in some embodiments, combining a PCM with a hydrophobic sorptionmaterial comprises adsorbing or absorbing a hydrophobic portion of aPCM, such as an aliphatic hydrocarbon portion of a PCM.

Further, in some embodiments, combining a PCM with a hydrophobicsorption material comprises saturating the hydrophobic sorption materialwith the PCM. Saturating a hydrophobic sorption material with a PCM, insome embodiments, comprises utilizing all or substantially all of theabsorbing and/or adsorbing capacity of the hydrophobic sorption materialby absorbing and/or adsorbing the PCM with the hydrophobic sorptionmaterial. In some embodiments, saturating a hydrophobic sorptionmaterial with a PCM comprises providing an excess amount of PCM, such asan amount of PCM greater than the oil absorption capacity (DBP) of thehydrophobic sorption material. Further, a saturated hydrophobic sorptionmaterial, in some embodiments, is unable or substantially unable toabsorb or adsorb additional chemical species, such as chemical speciespresent in the combination of the first and second mixtures, Forreference purposes herein, substantially all of the absorbing and/oradsorbing capacity of a substance comprises at least about 90 percent,at least about 95 percent, or at least about 99 percent of thesubstance's capacity.

In addition, in some embodiments, combining a PCM with a hydrophobicsorption material comprises partially encapsulating the PCM with thehydrophobic sorption material. Partially encapsulating a PCM with ahydrophobic sorption material, in some embodiments, does not comprisemicroencapsulating the PCM, such as with a polymer microcapsule.

Moreover, in some embodiments, combining a PCM with a hydrophobicsorption material comprises forming a gel. The gel comprises the PCM andthe hydrophobic sorption material. Further, a gel, in some embodiments,comprises a continuous phase formed from the PCM. In other embodiments,a gel comprises a discontinuous phase formed from the PCM. A phasecomprising a PCM, in some embodiments, can be a liquid phase or a solidphase. In addition, in some embodiments a gel comprises a solid phaseformed from a hydrophobic sorption material of the first mixture. Thesolid phase, in some embodiments, is a continuous phase. Further, insome embodiments, a gel does not comprise water or is substantially freeof water. For reference purposes herein, a substance that issubstantially free of water comprises less than about 10 weight percent,less than about 5 weight percent, less than about 1 weight percent, orless than about 0.1 weight percent water, based on the total weight ofthe substance.

Further, in some embodiments, a gel of a first mixture described hereinhas a viscosity between about 200 centipoise (cP) and about 20,000 cP,between about 200 cP and about 10,000 cP, between about 1000 cP andabout 15,000 cP, or between about 1000 cP and about 5000 cP, measuredaccording to ASTM standard D2983. Further, in some embodiments, a gelhas a viscosity between about 200 cP and about 50,000 cP at atemperature between about 20° C. and about 70° C. at 1 atm. In someembodiments, a gel has a viscosity between about 200 CP and about25,000, between about 200 cP and about 10,000 cP, or between about 1000cP and about 5000 cP at a temperature between about 20° C. and about 70°C. at 1 atm. Moreover, in some embodiments, a gel has a viscositybetween about 5000 cP and about 20,000 cP at a temperature between about−41° C. and about 40° C. at 1 atm or between about −30° C. and about 30°C. at 1 atm. In some embodiments, a gel has a viscosity between about5000 cP and about 20,000 cP at a temperature between about −50° C. andabout 0° C. at 1 atm or between about −20° C. and about 0° C. at 1 atm.In other embodiments, a gel has a viscosity between about 5000 cP andabout 20,000 cP at a temperature between about 30° C. and about 50° C.at 1 atm or between about 35° C. and about 45° C. at 1 atm. In someembodiments, a gel does not readily flow without the application of anexternal force or pressure. In some embodiments, a gel isself-supporting or non-encapsulated.

Moreover, in some embodiments described herein, forming a gel comprisesincreasing the viscosity of the first mixture. In some embodiments,forming a gel comprises increasing the viscosity of the first mixturefrom below about 100 centipoise (cP) to above about 100 cP when measuredaccording to ASTM standard D2983. In some embodiments, firming a gelcomprises increasing the viscosity of the first mixture from below about200 CP to above about 200 cP when measured according to ASTM standardD2983. In some embodiments, forming a gel comprises increasing theviscosity of the first mixture from below about 200 cP to between about200 cP and about 25,000 cP, between about 200 cP and about 10,000 cP,between about 1000 cP and about 15,000 cP, or between about 1000 cP andabout 5000 cP.

In addition, in some embodiments, combining a polyfunctional monomerwith a linker component comprises forming a chemical bond between thepolyfunctional monomer and the linker component. Further, in someembodiments, combining a polyfunctional monomer with a linker componentcomprises forming a pre-polymer. A pre-polymer, in some embodiments,comprises a plurality of chemical bonds between a polyfunctional monomerand a linker component. In some embodiments, a pre-polymer is partiallypolymerized. A partially polymerized pre-polymer, in some embodiments,comprises at least one unpolymerized functional group available foradditional polymerization. In some embodiments, a partially polymerizedpre-polymer comprises a plurality of unpolymerized functional groupsavailable for additional polymerization.

In addition, in some embodiments, a method described herein furthercomprises providing a second linker component. In some embodiments, thesecond linker component is added to the first mixture prior to combiningthe first mixture with the second mixture. In some embodiments, adding asecond linker component to the first mixture comprises forming achemical bond between the second linker component and the PCM of thefirst mixture. In some embodiments, the PCM is chemically bonded to thesecond linker component to provide a latent heat storage material. Thelatent heat storage material, in some embodiments, is non-polymeric, Insome embodiments, the PCM is chemically bonded to the second linkercomponent to provide an oligomeric latent heat storage material. Forexample, in some embodiments, a PCM comprises a monofunctional chemicalspecies, such as a fatty alcohol, fatty acid, or alkyl ester of a fattyacid. In some embodiments, a second linker component comprises apolyfunctional chemical species, such as a polyfunctional isocyanate. Amonofunctional chemical species of a PCM, in some embodiments, can bechemically bonded to a second linker component through a singlefunctional group of the monofunctional chemical species, such as acarboxyl or hydroxyl group. Further, a polyfunctional chemical speciesof a second linker component, in some embodiments, can be chemicallybonded to more than one chemical species of a PCM, including more than,one monofunctional chemical species. For example, in some embodiments, abifunctional second linker component (B) can be chemically bonded to twomonofunctional PCMs (A) to provide an A-B-A trimer. In otherembodiments, a bifunctional second linker component is chemically bondedto one monofunctional PCM to provide an A-B dimer.

Moreover, in some embodiments described herein, combining a firstmixture with a second mixture is carried out after forming a gel in thefirst mixture and/or forming a pre-polymer in the second mixture.Combining the first mixture with the second mixture after forming a gelin the first mixture and/or forming a pre-polymer in the second mixture,in some embodiments, permits non-competitive thickening of the first andsecond mixtures. In some embodiments, for example, the first mixture hasa viscosity between about 200 CP and about 25,000 cP measured accordingto ASTM standard D2983 when combined with the second mixture. In someembodiments, the first mixture has a viscosity between about 200 cP andabout 10,000 cP between about 1000 cP and about 15,000 cP, or betweenabout 1000 cP and about 5000 cP when combined with the second mixture.However, in some embodiments described herein, combining a first mixturewith a second mixture is carried out before substantial polymerizationhas occurred in the second mixture, Substantial polymerization, furreference purposes herein, comprises at least about 30 percentpolymerization or at least about 40 percent polymerization, based on theamount of available monomer. In some embodiments, polymerization in thesecond mixture is indicated by a temperature increase of the secondmixture. In some embodiments, combining a first mixture with a secondmixture is carried out soon after a temperature increase is observed inthe second mixture, such as within about 5 minutes or within about 1minute of aa temperature increase of between about 5° C. and about 15°C.

In addition, in some embodiments, combining a first mixture with asecond mixture comprises cross-linking one or more components of thefirst mixture with one or more components of the second mixture. Forexample, in some embodiments, a second linker component of the firstmixture is cross-linked with a polyfunctional monomer or pre-polymer ofthe second mixture. In some embodiments, the linker component of thesecond mixture is cross-linked with a PCM or latent heat storagematerial of the first mixture. In some embodiments, a gel of the firstmixture is cross-linked with a pre-polymer of the second mixture.

Further, in some embodiments, combining, a first mixture with a secondmixture is carried out at a temperature greater than a transitiontemperature of a PCM or latent heat storage material of the firstmixture. The transition temperature, in some embodiments, comprises asolid-liquid transition temperature of a PCM or latent heat storagematerial described herein. In some embodiments, the transitiontemperature comprises a solid-solid or solid gel transition temperatureof a PCM or latent heat storage material described herein. In someembodiments, a PCM or latent heat storage material at a temperatureabove a transition temperature described herein is unable to absorbthermal energy without a change in temperature of the PCM or latent heatstorage material. In some embodiments, the latent heat storage capacityof a PCM or latent heat storage material is fully or substantially fullyutilized prior to combining the first and second, mixtures. Therefore,in some embodiments, the PCM or latent heat storage material is, unableor substantially unable to absorb thermal energy needed for otherprocesses, such as forming a foam. For reference purposes herein,substantially full utilization of the latent heat storage capacity of asubstance comprises at least about 90 percent, at least about 95percent, or at least about 99 percent utilization. Further, in someembodiments, a first mixture has a viscosity between about 200 cP andabout 25,000 cP above a transition temperature described herein.

In addition, in some embodiments of methods described, herein, a firstmixture is free or substantially free of water. In some embodiments, asecond mixture is free or substantially free of water. Moreover, in someembodiments, a first mixture and a second mixture are both free orsubstantially free of water, including when the first mixture and thesecond mixture are combined.

A method described herein, in some embodiments, further comprisesproviding a catalyst. Providing a catalyst, in some embodiments,comprises adding a catalyst to the first mixture, such as when the firstmixture comprises a second linker component. In other embodiments,providing a catalyst comprises adding a catalyst to the second mixture.In some embodiments, providing a catalyst comprises adding a firstcatalyst to the first mixture and adding a second catalyst to the secondmixture. Further, in some embodiments, providing a catalyst comprisesadding a catalyst to the combination of the first and second mixtures.Adding a catalyst to a mixture or combination of mixtures describedherein, in some embodiments, facilitates additional reaction between oneor more components of the mixture or combination of mixtures. Forexample, in some embodiments, adding a catalyst facilitates additionalpolymerization, gelling, and/or cross-linking. Further, in someembodiments, adding a catalyst to the first and/or second mixture, priorto combining the first and second mixtures provides separate mixtureshaving desired viscosities, including a viscosity corresponding topartial polymerization and/or gelling.

In addition, a method described herein, in some embodiments, furthercomprises providing a blowing agent. A blowing agent, in someembodiments, is added to the combination of the first and secondmixtures. Adding a blowing agent to the combination of the first andsecond mixtures, in some embodiments, facilitates the formation of afoam.

A method described herein, in some embodiments, further comprisesproviding an aqueous polymeric material. In some embodiments, providingan, aqueous polymeric material comprises adding the aqueous polymericmaterial to the combination of the first and second mixtures. An aqueouspolymeric material, in some embodiments, comprises an, organic polymeror biopolymer dispersed in water. In some embodiments, the polymer is ateast partially water soluble. In other embodiments, the polymer issuspended in water. Further, in some embodiments, an aqueous polymericmaterial described herein acts as a blowing agent.

Moreover, in some embodiments, a method described herein furthercomprises providing one or more additives. One or more additives, insome embodiments, are added to the first mixture. In some embodiments,one or more additives are added to the second mixture. In someembodiments, one or more additives are added to the combination of thefirst and second mixtures. Further, in some embodiments, an additivedescribed herein provides one or more properties to a foam made by amethod described herein. In some embodiments, for instance, an additiveprovides thermal conductivity modulation, antimicrobial activity, orfire resistance.

Turning now to specific steps of methods, methods described hereincomprise combining a PCM with a hydrophobic sorption material to providea first mixture. Combining a PCM with a hydrophobic sorption materialcan be carried out in any manner not inconsistent with the objectives ofthe present invention. For example, in some embodiments, combining iscarried out using a line addition process using one or more lines. Insome embodiments, combining comprises mixing or stirring. Mixing orstirring can be carried out at any temperature not inconsistent with theobjectives of the present invention. In some embodiments, mixing orstirring is carried out at a temperature greater than room temperature,in some embodiments, mixing or stirring is carried out at a temperaturegreater than a state or phase transition temperature of one or morecomponents of the first mixture, such as a melting point. Moreover,mixing or stirring can be carried out for any duration not inconsistentwith the objectives of the present invention. In some embodiments, forinstance, mixing or stirring is carried out for less than about 60minutes, less than about 30 minutes, or less than about 10 minutes. Insome embodiments, mixing or stirring is carried out for a durationbetween about 1 minute and about 60 minutes, between about 10 minutesand about 50 minutes, or between about 20 minutes and about 40 minutes.Further, in some embodiments, the temperature and duration of mixing orstirring is selected based on a desired viscosity of the first mixtureand/or the identity or reactivity of one or more components of the firstmixture.

In addition, any PCM not inconsistent, with the objectives of thepresent invention may be used. In some embodiments, a PCM does notcomprise a microcapsule or microencapsulation agent and/or is notencapsulated. Further, in some embodiments, a PCM is non-polymeric. Insome embodiments, a PCM comprises a monofunctional chemical species. Forexample, in some embodiments, a PCM comprises a fatty acid. A fattyacid, in some embodiments, can have a C4 to C28 aliphatic hydrocarbontail. Further, in some embodiments, the hydrocarbon tail is saturated.Alternatively, in other embodiments, the hydrocarbon tail isunsaturated. In some embodiments, the hydrocarbon tail can be branchedor linear. Non-limiting examples of fatty acids suitable for use in someembodiments described herein include caprylic acid, capric acid, lauricacid, myristic acid, palmitic acid, stearic acid, arachidic acid,behenic acid, lignoceric acid, and cerotic acid. In some embodiments, aPCM described herein comprises a plurality of differing fatty acids.

In some embodiments, a PCM comprises an alkyl ester of a fatty acid. Anyalkyl ester not inconsistent with the objectives of the presentinvention may be used. For instance, in some embodiments, an alkyl estercomprises a methyl, ethyl, propyl, or butyl ester of a fatty aciddescribed herein. In other embodiments, an alkyl ester comprises a C2 toC6 ester alkyl backbone or a C6 to C12 ester alkyl backbone. In someembodiments, an alkyl ester comprises a C12 to C28 ester alkyl backbone.Further, in some embodiments, a PCM described herein comprises aplurality of differing alkyl esters of fatty acids. Non-limitingexamples of alkyl esters of fatty acids suitable for use in someembodiments described herein include methyl laurate, methyl myristate,methyl palmitate, methyl stearate, methyl palmitoleate, methyl oleate,methyl linoleate, methyl docosahexanoate, and methyl ecosapentanoate. Insome embodiments, the corresponding ethyl, propyl, or butyl esters mayalso be used.

In some embodiments, PCM comprises a fatty alcohol. Any fatty alcoholnot inconsistent with the objectives of the present invention may beused. For instance, a fatty alcohol, in some embodiments, can have a C4to C28 aliphatic hydrocarbon tail. Further, in some embodiments, thehydrocarbon tail is saturated. Alternatively, in other embodiments, thehydrocarbon tail is unsaturated. In some embodiments, the hydrocarbontail can be branched or linear. Non-limiting examples of fatty alcoholssuitable for use in some embodiments described herein include caprylalcohol, pelargonic alcohol, capric alcohol, underyl alcohol, laurylalcohol, tridecyl alcohol, myristyl alcohol, pentadecyl alcohol, cetylalcohol, heptadecyl alcohol, stearyl alcohol, nonadecyl alcohol,arachidyl alcohol, heneicosyl alcohol, behenyl alcohol, lignocerylalcohol, ceryl alcohol, and montanyl alcohol. In some embodiments, a PCMcomprises a plurality of differing fatty alcohols.

In some embodiments, a PCM comprises a fatty sulfonate or phosphonate.Any fatty sulfonate or phosphonate not inconsistent with the objectivesof the present invention may be used. In some embodiments, a PCMcomprises a C4 to C28 alkyl sulfonate or phosphonate. In someembodiments, a PCM comprises a C4 to C28 alkenyl sulfonate orphosphonate. Further, in some embodiments, a PCM comprises apolyethylene glycol. Any polyethylene glycol not inconsistent with theobjectives of the present invention may be used.

In some embodiments, a PCM comprises a paraffin. Any paraffin notinconsistent with the objectives of the present invention may be used.In some embodiments, a paraffin comprises an n-alkane. In someembodiments, a paraffin comprises a C10 to C60 alkane. In someembodiments, a paraffin comprises a C20 to C50 alkane or a C30 to C40alkane. In some embodiments, a paraffin comprises a C10 to C30 alkane ora C14 to C28 alkane, examples of paraffins suitable for use in someembodiments described herein include n-dodecane, n-tridecane,n-tetradecane, n-pentadecane, n-hexadecane, n-heptadecane, n-octadecane,n-nonadecane, n-icosane, n-henicosane, n-docosane, n-tricosane,n-tetracosane, n-pentacosane, n-hexacosane, n-heptacosane, n-octacosane,n-nonacosane, n-triacontane, n-hentriacontane, n-dotriacontane,n-tritriacontane, and/or mixtures thereof.

In some embodiments, a PCM comprises a salt hydrate. Any salt hydratenot inconsistent with the objectives of the present invention may beused. Non-limiting examples of salt hydrates suitable for use in someembodiments described herein include KF⋅4H₂O, Mn(NO₃)₂⋅6H₂O, CaCl₂⋅6H₂O,CaBr₂⋅6H₂O, Li(NO₃)⋅6H₂O, Na₂SO₄⋅10H₂O, Na₂CO₃⋅10H₂O, Na₂HPO₄⋅12H₂O,Zn(NO₃)₂⋅6H₂O, Ca(NO₃)₂⋅3H₂O, Na(NO₃)₂⋅6H₂O, Zn(NO₃)₂⋅2H₂O, FeCl₃⋅2H₂O,Co(NO₃)₂⋅6H₂O, Ni(NO₃)₂⋅6H₂O, MnCl₂⋅4H₂O, CH₃COONa⋅3H₂O, LiC₂H₃O₂⋅2H₂O,MgCl₂⋅4H₂O, NaOH⋅H₂O, Cd(NO₃)₂⋅4H₂O, Cd(NO₃)₂⋅1H₂O, Fe(NO₃)₂⋅6H₂O,NaAl(SO₄)₂⋅12H₂O, FeSO₄⋅7H₂O, Na₃PO₄⋅12H₂O, Na₂B₄O₇⋅10H₂O, Na₃PO₄⋅12H₂O,LiCH₃COO⋅2H₂O, and/or mixtures thereof.

In some embodiments, a PCM described herein comprises a plurality ofdiffering chemical species. Any combination of differing chemicalspecies not inconsistent with the objectives of the present inventionmay be used. In some embodiments, for example, a PCM comprises one ormore fatty acids and one or more fatty alcohols. Moreover, in someembodiments comprising a PCM comprising a plurality of differingchemical species, the plurality of chemical species comprises betweenabout 1 and about 99 weight percent fatty acid based on the total weightof the plurality of chemical species. In some embodiments, the pluralitycomprises between about 10 and about 90 weight percent, between about 20and about 80 weight percent. between about 30 and about 70 weightpercent, or between about 50 and about 90 weight percent fatty acid. Insome embodiments, a plurality of chemical species comprises betweenabout 1 and about 99 weight percent alkyl ester of a fatty acid. In someembodiments, the plurality comprises between about 10 and about 90weight percent, between about 20 and about 80 weight percent, betweenabout 30 and about 70 weight percent, or between about 50 and about 90weight percent alkyl ester at a fatty acid. Further, in someembodiments, plurality of chemical species comprises between about 1 andabout 9 weight percent fatty alcohol. In some embodiments, the pluralitycomprises between about 10 and about 90 weight percent, between about 20and about 80 weight percent, between about 30 and about eight percent,between about 5 and about 50 weight percent, or between about 5 andabout eight percent fatty alcohol.

Further, in some embodiments, plurality of differing chemical species ofa PCM selected based on a desired viscosity and/or latent heat of thePCM or a latent heat storage material comprising the PCM. In someembodiments, a plurality of differing chemical species is selected basedon a desired state or phase transition temperature of a PCM or latentheat storage material. A state or phase transition temperature, in someembodiments, is between about −50° C. and about 100° C. at 1 atm,between about −50° C. and about 50° C. at 1 atm, or between about −40°C. and about 40° C. at 1 atm. In some embodiments, a state or phasetransition temperature is between about 50° C. and about 0° C. at 1 atmor between about −20° C. and about 0° C. at 1 atm. In some embodiments,a state or phase transition temperature is between about 0° C. and about70° C. at 1 atm or between about −4° C. and about 40° C. at 1 atm. Inother embodiments, a state or phase transition temperature is betweenabout 30° C. and about 50° C. at 1 atm or between about 35° C. and about45° C. at 1 atm.

A PCM described herein can be present in a first mixture in any amountnot inconsistent with the objectives of the present invention. In someembodiments, for instance, a first mixture comprises up to about 80weight percent or up to about 90 weight percent PCM based on the totalweight of the first mixture. In some embodiments, a first mixturecomprises up to about 95 weight percent or up to about 99 weight percentPCM. In some embodiments, a first mixture comprises between about 50weight percent and about 99 weight percent, between about 70 weightpercent and about 95 weight percent, or between about 80 weight percentand about 90 weight percent PCM. In some embodiments, a first mixturecomprises between about 90 weight percent and about 99 weight percentPCM.

Moreover, a PCM or latent heat storage material described herein can bepresent in the combination of the first and second mixtures in anyamount not inconsistent with the objectives of the present invention.For example, in some embodiments, the combination of the first andsecond mixtures comprises up to about 60 weight percent PCM or latentheat storage material, in some embodiments, the combination of the firstand second mixtures comprises up to about 50 weight percent PCM orlatent heat storage material. In some embodiments, the combination ofthe first and second mixtures comprises between about 1 weight percentand about 60 weight percent, between about 10 weight percent and about50 weight percent, between about 20 weight percent and about 40 weightpercent, or between about 20 weight percent and about 30 weight percentPCM or latent heat storage material.

In addition, a hydrophobic sorption material of a first mixturedescribed herein can comprise any chemical species not inconsistent withthe objectives of the present invention. In some embodiments, forinstance, a hydrophobic sorption material comprises an aerogel. Anyaerogel not inconsistent with the objectives of the present inventionmay be used. An aerogel, in some embodiments, comprises an organiccomposition such as agar. In some embodiments, an aerogel comprisescarbon. In some embodiments, an aerogel comprises alumina. In someembodiments, an aerogel comprises silica, including fumed silica.Moreover, an aerogel comprising tamed silica, in some embodiments,comprises particles having a size from about 1 μm to about 10 mm. Insome embodiments, the particles have a size from about 1 μm to about 100μm, from about 1 μm to about 10 μm, or from about 5 μm about 10 μm.Further, in some embodiments, an ager gel has high porosity. Forinstance, in some embodiments, an aerogel comprises over 90 percent air.In addition, in some embodiments, an aerogel comprises pores having asize between about 1 nm and about 100 nm. In some embodiments, the poreshave a size between about 10 nm and about 100 nm or between about 20 nmand about 40 nm. Moreover, an aerogel described herein, in someembodiments, has a high surface area, such as a surface area of about500 m²/g or more. In some embodiments, an aerogel has a surface areabetween about 500 m²/g, and about 1000 m²/g or between about 600 m²/gand about 900 m²/g. In addition, in some embodiments, an aerogel has alow tap density. In some embodiments, for instance, an aerogel has atap, density less than about 500 kg/m³ or less than about 100 kg/m³. Insome embodiments, an aerogel has a tap density between about 1 kg/m³ andabout 200 kg/m³ or between about 10 kg/m³ and about 100 kg/m³. Further,in some embodiments, an aerogel described herein has a low thermalconductivity. In some embodiments, an aerogel has a thermal conductivityless than about 50 mW/mK or less than about 20 mW/mK. In someembodiments, an aerogel has a thermal conductivity between about 1 mW/mKand about 20 mW/mK or between about 5 mW/mK and about 15 mW/mK.Moreover, in some embodiments, an aerogel has a hydrophobic surface. Inaddition, in some embodiments, an aerogel has a high oil absorptioncapacity (DBP). In some embodiments, an aerogel has an oil absorptioncapacity greater than about 100 g/100 g. In some embodiments, an aerogelhas an oil absorption capacity greater than about 500 g/100 g. In someembodiments, an aerogel has an oil absorption capacity between about 100g/100 g and about 1000 g/100 g, between about 300 g/100 g and about 800g/100 g, or between about 400 g/100 g and about 600 g/100 g. Further, insome embodiments, an aerogel has a specific heat capacity between about0.1 kJ/(kg K) and about 5 kJ/(kg K). In some embodiments, an aerogel hasa specific heat capacity between about 0.5 kJ/(kg K) and about 1.5kJ/(kg K).

In other embodiments, a hydrophobic sorption material comprises apolymeric material. Any polymeric material not inconsistent with theobjectives of the present invention may be used. In some embodiments, apolymeric material comprises an organic composition. For example, insome embodiments, a polymeric material comprises a polyolefin such aspolyethylene or polypropylene, a polycarbonate, a polyester, or a polyethane. In some embodiments, a polymeric. material comprises polyvinylalcohol (PVA). In some embodiments, a polymeric material comprises anacrylonitrile, including a polyacrylonitrile or acrylonitrile copolymer.An acrylonitrile copolymer, in some embodiments, comprisesstyrene-acrylonitrile (SAN), acrylonitrile styrene acrylate (ASA),acrylonitrile butadiene (NBR), or acrylonitrile butadiene styrene (ABS).In some embodiments, a hydrophobic sorption material comprises aparticulate polymeric material, such as ABS grains.

In some embodiments, a polymeric material comprises a styrene blockcopolymer (SBC). A styrene block copolymer, in some embodiments,comprises a linear triblock copolymer. The linear triblock copolymer, insome embodiments, comprises an A-B-A structure, where the A blockscomprise polystyrene and the B block comprises an elastomer. someembodiments, an SBC comprises between about 20 percent and about 40percent polystyrene. In some embodiments, an SBC comprises between about25 percent and about 35 percent polystyrene. Further, in someembodiments, an SBC can be maleated or unmaleated. Moreover, in someembodiments, an SBC has an average molecular weight greater than about75,000. In some embodiments, an SBC has an average molecular weightgreater than about 200,000. In some embodiments, an SBC has an averagemolecular weight between about 75,000 and about 1,000,000, between about75,000 and about 500,000, or between about 100,000 and about 300,000.For reference purposes herein, molecular weight comprises weight averagemolecular weight. In addition, in some embodiments, an SBC has aspecific gravity less than about 1. In some embodiments, an SBC has aShore A hardness between about 50 and about 100. In some embodiments, anSBC has a Shore A hardness between about 50 and about 75 or betweenabout 55 and about 70. Non-limiting examples of SBCs useful in someembodiments described herein include styrene-ethylene-butylene-styrene,styrene-ethylene-propylene-styrene,styrene-ethylene-ethylene/propylene-styrene,styrene-isobutylene-styrene, styrene-butadiene-styrene,styrene-isoprene-styrene, and combinations thereof. Commerciallyavailable SBCs useful in some embodiments described herein include Stiesprovided by Kraton Polymers (Houston, Tex.), such as Kraton G165HU,Kraton G1650, Kraton G1652, and Kraton G1654H.

In some embodiments, a polymeric material comprises a biopolymer. Forinstance, in some embodiments, a polymeric material comprises celluloseor a cellulosic material or cellulose derivative. In some embodiments, apolymeric material comprises hydroxymethyl cellulose (HMC), hydroxyethylcellulose (HEC), hydroxypropyl cellulose (HPC), hydroxypropylmethylcellulose (HPMC), hydroxypropyl methylcellulose phthalic ester (HPMCP),methyl cellulose (MC), ethyl cellulose (EC), carboxymethyl cellulose(CMC), and/or polyanionic cellulose (PAC). In some embodiments, acellulosic material or cellulose derivative has a molecular weightbetween about 100,000 and about 2,000,000. In some embodiments, acellulosic material or cellulosic derivative has a molecular weightbetween about 250,000 and about 1,500,000, between about 250,000 andabout 450,000, between about 750,000 and about 950,000, or between about1,000,000 and about 1300,000. Further, in some embodiments, a polymericmaterial comprises chitosan. In some embodiments, the chitosan has amolecular weight between about 3000 and about 20,000. Further, in someembodiments, the chitosan has a degree of deacetylation between about 50percent and about 100 percent.

In some embodiments, a hydrophobic sorption material comprises azeolite. Any zeolite not inconsistent with the objectives of the presentinvention may be used. In some embodiments, a zeolite comprises anatural zeolite. In other embodiments, a zeolite comprises an artificialzeolite. In some embodiments, a zeolite comprises a silicate and/oraluminosilicate. In some embodiments, a zeolite comprises a compositionaccording to the formula M_(x/n) [(AlO₂)_(x)(SiO₂)_(y)]⋅w H₂O, where nis the valence of cation M (e.g., Na⁺, K⁺, Ca²⁺, or Mg²⁺), w is thenumber of water molecules per unit cell, and x and y are the totalnumber of tetrahedral atoms per unit cell. Non-limiting examples ofzeolites suitable for use in some embodiments described herein includeanalcime ((K,Ca,Na)AlSi₂O₆⋅H₂O), chabazite((Ca,Na₂,K₂,Mg)Al₂Si₄O₁₂⋅6H₂O), clinoptilolite ((Na,K,Ca)₂₋₃Al₃(Al,Si)₂Si₁₃O₃₆⋅12H₂O), heulandite ((Ca,Na)₂₋₃Al₃(Al,Si)₂Si₁₃O₃₆⋅12H₂O)),natrolite (Na₂Al₂Si₃O₁₀⋅2H₂O), phillipsite (Ca,Na₂,K₂)₃Al₆Si₁₀O₃₂⋅12H₂),and stilbite (NaCa₄(Si₂₇Al₉)O₇₂⋅28(H₂O)).

Further, in some embodiments, a method described herein comprisesproviding a plurality of differing hydrophobic sorption materials, Anycombination of differing hydrophobic sorption materials not inconsistentwith the objectives of the present invention may be used. For instance,in some embodiments, a first mixture comprises an aerogel and apolymeric material. In some embodiments, a first mixture comprises oneor more aerogels, one or more polymeric materials, and/or one or morezeolites. Further, in some embodiments, a plurality of differinghydrophobic sorption materials Ag of a first mixture is selected basedon a desired viscosity of the first mixture.

In addition, a hydrophobic sorption material or plurality of hydrophobicsorption materials described herein can be present in a first mixture inany amount not inconsistent with the objectives of the presentinvention. In some embodiments, for instance, a first mixture describedherein comprises less than about 20 weight percent hydrophobic sorptionmaterial. In some embodiments, a first mixture comprises less than about10 weight percent, less than about 5 weight percent, less than about 3weight percent, less than about 2 weight percent, or less than about 1weight percent hydrophobic sorption material. In some embodiments, afirst mixture comprises between about 1 weight percent and about 20weight percent, between about 1 weight percent and about 10 weightpercent, between about 1 weight percent and about 5 weight percent, orbetween about 5 weight percent and about 10 weight percent hydrophobicsorption material.

Methods described herein, in some embodiments, also comprise providing asecond linker component. The second linker component can comprise anychemical species not inconsistent with the objectives of the presentinvention. In some embodiments, for instance, a second linker componentcomprises a polyfunctional chemical species, including a bifunctionalchemical species. A polyfunctional chemical species, in someembodiments, comprises more than one functional group capable of forminga chemical bond with a PCM described herein, such as an isocyanate groupor hydroxyl group. Moreover, a chemical bond between a PCM and a secondlinker component can comprise any chemical bond not inconsistent withthe objectives of the present invention. In some embodiments, forexample, a chemical bond comprises a covalent bond. In otherembodiments, a chemical bond comprises an ionic bond, or electrostaticbond. In some embodiments, a chemical bond comprises a hydrogen bond. Insome embodiments, a chemical bond comprises a urethane bond. In otherembodiments, a chemical bond comprises an amide bond. In someembodiments, a chemical bond comprises an ester bond.

In some embodiments, a second linker component comprises an isocyanate.In some embodiments, a second linker component comprises a diisocyanate,such as a methylene diphenyl diisocyanate (MDI) toluene diisocyanate(TDI), naphthalene diisocyanate (NDI), isophorone diisocyanate (IPDI),and/or hexamethylene diisocyanate (HDI). Non-limiting examples ofdiisocyanates suitable for use in some embodiments described hereininclude Lupranate® LP27, LP30, LP30D, M, MI, MS, M10, M10, M20, M20S,M20FB, M20HB, M20SB, M70L, MM103, MP102, MS, R2500, R2500U, T80-Type 1,T80-Type 2, TF2115, 78, 81, 219, 223, 227, 230, 234, 245, 259, 265, 266,273, 275, 278, 280, 281, 5010, 5020, 5030, 5040, 5050, 5060, 5070, 5080,5090, 5100, 5110, 5140, 5143, and 8020, all commercially available fromBASF. Other non-limiting examples of diisocyanates suitable for use insome embodiments described herein include Suprasec® 2004, 2029, 5025,7316, 7507, 9150, 9561, 9577, 9582, 9600, 9603, 9608, 9612, 9610, 9612,9615, and 9616 as well as Rubinate® 1209, 1234, 1670, 1790, 1920, 9040,9214, 9236, 9271, 9272, 9465, and 9511, all available from Huntsman.Other major producers of diisocyanates include Bayer BorsodChem, Dow,Mitsui, Nippon Polyurethane Industry and Yantai Wanhua.

In other embodiments, a second linker component comprises a polyol. Insome embodiments, a second linker component comprises a saccharide,including a monosaccharide disaccharide, oligosaccharide, orpolysaccharide. A polysaccharide, in some embodiments, comprisescellulose or a cellulose derivative. Further, in some embodiments asecond linker component comprises a sugar alcohol, such as glycol,glycerol, erythritol, threitol, arabitol, ribitol, mannitol, sorbitol,dulcitol, isomalt, maltitol, or lactitol.

A second linker component described herein can be present in a firstmixture in any amount not inconsistent with the objectives of thepresent invention. In some embodiments, for instance, a first mixturedescribed herein comprises less than about 10 weight percent secondlinker component. In some embodiments, a first mixture comprises lessthan about 5 weight percent, less than about 3 weight percent, less thanabout 2 weight percent, or less than about 1 weight percent secondlinker component. In some embodiments, a second mixture comprisesbetween about 1 weight percent and about 5 weight percent or betweenabout 1 weight percent about 5 weight percent second linker component.Further, in some embodiments, a first mixture comprises less secondlinker component than PCM. For example, in some embodiments, the ratioof PCM to second linker component is greater than about 2:1, greaterthan about 5:1, greater than about 10:1, greater than about 20:1, orgreater than about 40:1 by weight. In some embodiments, the ratio of PCMto second linker component is between about 2:1 and about 50:1 orbetween about 5:1 and about 30:1.

Methods described, herein also comprise combining a polyfunctionalmonomer with a linker component to provide a second mixture. Combining apolyfunctional monomer with a linker component can be carried out in anymanner not inconsistent with the objectives of the present invention.For example, in some embodiments, combining is carried out using a lineaddition process using one or more lines. In some embodiments, combiningcomprises mixing or stirring. Mixing or stirring can be carried out atany temperature not inconsistent with the objectives of the presentinvention. In some embodiments, mixing or stirring is carried out at atemperature greater than room temperature. In some embodiments, mixingor stirring is carried out at a temperature greater than a state orphase transition temperature of one or more components of the secondmixture, such as a melting point. Moreover, mixing or stirring can becarried out tor any duration not inconsistent with the objectives of thepresent invention. In some embodiments, for instance, mixing or stirringis carried out for less than about 60 minutes, less than about 30minutes, or less than about 10 minutes. In some embodiments, mixing orstirring is carried out for a duration between about 1 minute and about60 minutes, between about 10 minutes and about 50 minutes, or betweenabout 20 minutes and about 40 minutes. Further, in some embodiments, thetemperature and duration of mixing or stirring is selected based on adesired viscosity of the second mixture and/or the identity orreactivity of one or more components of the second mixture.

In addition, any polyfunctional monomer not inconsistent with theobjectives of the present invention may be used. A polyfunctionalmonomer, in some embodiments, comprises more than one polymerizablefunctional group, such as an isocyanate group or hydroxyl group. In someembodiments, a polyfunctional monomer comprises a polyurethane monomer,such as a polyol. Any polyol not inconsistent with the objectives of thepresent invention may be used. In some embodiments, a polyol comprises adiol. In some embodiments, a polyol comprises a triol. In someembodiments, for example, a polyol comprises castor oil. In someembodiments, a polyol comprises a polymer or oligomer. In someembodiments, for instance, a polyol comprises a polyether polyol. Insome embodiments, a polyol comprises a poly(tetramethylene ether)glycol. In some embodiments, a polyol comprises a polyester polyol. Insome embodiments, a polyol comprises a graft polyol or filled polyol. Agraft polyol or filled polyol, in some embodiments, comprises astyrene-acrylonitrile, acrylonitrile, or polyurea polymer chemicallygrafted to a polyether backbone. In some embodiments, a polyol comprisesa fluorinated polyol. Further, in some embodiments, a polyol has amolecular weight greater than about 100. In some embodiments, a, polyolhas a molecular weight greater than about 1000 or greater than about2000. In some embodiments, a polyol has a molecular weight between about100 and about 1000, between about 200 and about 800, or between about300 and about 700. In some embodiments, a polyol has a molecular weightbetween about 500 and about 2500 or between about 700 and about 2000. Insome embodiments, a polyol has a molecular weight ranging from about1000 to about 10,000 or from about 2000 to about 10,000. Moreover, insome embodiments, a polyol has a polydisperse molecular weight. Further,in some embodiments, a polyfunctional monomer described herein comprisesa plurality of differing polyols. In some embodiments, a plurality ofdiffering polyols is selected based on a desired density, flexibility,or mechanical strength of a foam made by a method described herein.

A polyfunctional monomer described herein can be present in the secondmixture in any amount not inconsistent with the objectives of thepresent invention. In some embodiments, for instance, a second mixturecomprises up to about 70 weight percent or up to about 80 weight percentpolyfunctional monomer. In some embodiments, a second mixture comprisesbetween about 20 weight percent and about 80 weight percent, betweenabout 30 weight percent and about 70 weight percent, or between about 40weight percent and about 60 weight percent polyfunctional monomer.

In addition, a linker component of a second mixture described herein cancomprise any chemical species not inconsistent with the objectives ofthe present invention. In some embodiments, for instance, a linkercomponent comprises a polyfunctional chemical species, including abifunctional chemical species. A polyfunctional chemical species, insome embodiments, comprises more than one functional group capable offorming a chemical bond with a polyfunctional monomer described herein,such as an isocyanate or carboxyl group. Moreover, a chemical bondbetween a polyfunctional monomer and a linker component described hereincan comprise any chemical bond not inconsistent with the objectives ofthe present invention. In some embodiments, for example, a chemical bondcomprises a covalent bond. In other embodiments, a chemical bondcomprises an ionic bond or electrostatic bond. In some embodiments, achemical bond comprises a hydrogen bond. In some embodiments, a chemicalbond comprises a urethane bond. In some embodiments, a chemical bondcomprises an ester bond.

In some embodiments, a linker component comprises an isocyanate,including a polyfunctional isocyanate. In some embodiments, a linkercomponent comprises a diisocyanate, such as a methylene diphenyldiisocyanate (MDI), toluene diisocyanate (TDI), naphthalene dilsocyanate(NDI), isophorone diisocyanate (IPDI), and/or hexamethylene diisocyanate(HDI). Non-limiting examples of diisocyanates suitable for use in someembodiments described herein include Lupranate® LP27 , LP30, LP30D, M,MI, MS, M10, M20, M20S, M20FB, M20HB, M20SB, M70L, MM103, MP102, MS,R2500, R2500U, T80-Type 1, T80-Type 2, TF2115, 78 81, 219, 223, 227,230, 234, 245, 259, 265, 266, 273, 275, 278, 280, 281, 5010, 5020, 5030,5040, 5050, 5060, 5070, 5080, 5090, 5100, 5110, 5140, 5143, and 8020,all commercially available from BASF. Other non-limiting examples ofdilsocyanates suitable for use in some embodiments described hereininclude Suprasec® 2004, 2029, 5025, 7316, 7507, 9150, 9561, 9577, 9582,9600, 9603, 9608, 9612, 9610, 9612, 9615, and 9616 as well as Rubinate®1209, 1234, 1670 1790, 1920, 9040, 9234, 9235, 9271, 9272, 9465, and9511, all commercially available from Huntsman.

In some embodiments, a linker component comprises a carboxylic acid,including a dicarboxylic acid. Any dicarboxylic acid not inconsistentwith the objectives of the present invention be used.

A linker component described herein can be present in a second mixturein any amount not inconsistent with the objectives of the presentinvention. In some embodiments, for instance, a second mixture describedherein comprises less than about 80 weight percent linker component. Insome embodiments, a second mixture comprises less than about 70 weightpercent, less than about 60 weight percent, less than about 50 weightpercent, or less than about 40 weight percent linker component. In someembodiments, a second mixture comprises between about 20 weight percentand about 80 weight percent linker component or between about 30 weightpercent about 70 weight percent linker component.

Methods described herein also comprise combining a first mixture with asecond mixture. The first and second mixtures can be combined in anymanner not inconsistent with the objectives of the present inventionexample. In some embodiments, combining comprises mixing or stirring.Mixing or stirring can be carried out at any temperature notinconsistent with the objectives of the present invention. In someembodiments, mixing or stirring is carried out at a temperature greaterthan room temperature. In some embodiments, mixing or stirring iscarried out, at a temperature greater than a state or phase transitiontemperature of one or more components of the first and/or secondmixture, such as a melting point. Moreover, mixing or stirring can becarried out for any duration not inconsistent with the objectives of thepresent invention. In some embodiments, for instance, mixing or stirringis carried out for less than about 60 minutes, less than about 30minutes, or less than about 10 minutes. In some embodiments, mixing orstirring is carried out for a duration between about 1 minute and about60 minutes, between about 10 minutes and about 50 minutes, or betweenabout 20 minutes and about 40 minutes. Further, in some embodiments, thetemperature and duration of mixing or stirring is selected based on adesired property of a foam and/or the identity or reactivity of one ormore components of the first mixture and/or second mixture.

Moreover, the first and second mixtures can be combined in any ratio notinconsistent with the objectives of the present invention. In someembodiments, for instance, the weight ratio of the first mixture to thesecond mixture is between about 1:100 and about 2:1. In someembodiments. the weight ratio of the first mixture to the second mixtureis between about 1:50 and about 1:1. In some embodiments, the weightratio of the first mixture to the second mixture is between about 1:20and about 1:1, between about 1:10 and about 1:1, between about 1:5 andabout 1:1, or between about 1:5 and about 2:1.

Methods described herein, embodiments, further comprise providing acatalyst. A catalyst can be provided in any manner not inconsistent withthe objectives of the present invention. In some embodiments, forinstance, providing, a catalyst comprises providing a catalyst powder.Moreover, in some embodiments, a catalyst is provided in an amount lessthan about 0.1 weight percent of the mixture or combination of mixturesto which the catalyst is added. In some embodiments, a catalyst isprovided in an amount between about 0.001 and about 0.1 weight percent.

Further, an catalyst not inconsistent with the objectives of the presentinvention may be used. In some embodiments, a catalyst is selected basedon a desired chemical bond and/or reaction rate. For example, in someembodiments, a catalyst comprises a urethane catalyst. In someembodiments, a catalyst comprises a tertiary amine, such astriethylamine or triethanolamine. In other embodiments, a catalystcomprises an organometallic complex. In some embodiments, a catalystcomprises a metal complex comprising mercury, lead, tin, bismuth orzinc, including organometallic complexes. In some embodiments, acatalyst comprises a dibutyltin, such as dibutyltin laurate.

In addition, in some embodiments, a method described herein furthercomprises providing a blowing agent. A blowing agent can be provided inany manner not inconsistent with the objectives of the presentinvention. In some embodiments, a blowing agent is provided as a liquid,in some embodiments, a blowing agent is provided as a gas. Moreover, insome embodiments, a blowing agent is provided in an amount less thanabout 0.1 weight percent of the combination of the first and secondmixtures. In some embodiments, a blowing agent is provided in an amountbetween about 0.001 and about 0.1 weight percent. Further, any blowingagent not inconsistent with the objectives of the present invention maybe used. In some embodiments, for instance, a blowing agent compriseswater. In some embodiments, a blowing agent comprises a halocarbon. Insome embodiments, a blowing agent comprises a hydrocarbon. In someembodiments, a blowing agent comprises carbon dioxide.

Methods described herein, in some embodiments, further compriseproviding an aqueous polymeric material. An aqueous polymeric materialcan be provided in any manner not inconsistent with the objectives ofthe present invention. In some embodiments, providing an aqueouspolymeric material comprises adding the aqueous polymeric material tothe combination of the first and second mixtures. Further, in someembodiments, an aqueous polymeric material is added to the combinationof the first and second mixtures after a catalyst is added to the firstmixture, second mixture, and/or the combination of the first and secondmixtures. Moreover, an aqueous polymeric material described herein canbe provided in any amount not inconsistent with the objectives oldiepresent invention. In some embodiments, for instance, an aqueouspolymeric material is provided in an amount less than about 1 weightpercent or less than about 0.1 weight percent of the combination of thefirst and second mixtures. In some embodiments, an aqueous polymericmaterial is provided in an amount between about 0.1 weight percent andabout 1 weight percent or between about 0.001 and about 0.1 weightpercent.

Further, any aqueous polymeric material not inconsistent with theobjectives of the present invention may be used. In some embodiments, anaqueous polymeric material comprises an organic polymer or biopolymerdispersed in water. In some embodiments, the polymer is at leastpartially water soluble. In other embodiments, the polymer is suspendedin water. Any organic polymer or biopolymer not inconsistent with theobjectives of the present invention may be used. For instance, in someembodiments, a polymer comprises cellulose or a cellulosic material orcellulose derivative, including a cellulose, cellulosic material, orcellulose derivative described hereinabove regarding a hydrophobicsorption material. In some embodiments, a polymer comprises a chitosan,including a chitosan described hereinabove regarding a hydrophobicsorption material. In addition, in some embodiments, an aqueouspolymeric material described herein comprises less than about 10 weightpercent polymer. In some embodiments, an aqueous polymeric materialcomprises less than about 5 weight percent polymer. In some embodiments,an aqueous polymeric material comprises between about 1 weight percentand about 10 weight percent or between about 1 weight percent and about5 weight percent, polymer. The balance of the aqueous polymericmaterial, in some embodiments, comprises water or consists essentiallyof water.

Methods described herein, in some embodiments, further compriseproviding one or more additives. Providing one or more additives can becarried out in any manner not inconsistent with the objectives of thepresent invention. In some embodiments, one or more additives are addedto the first mixture prior to combining the first mixture with thesecond mixture. In some embodiments, one or more additives are added tothe second mixture prior to combining the first mixture with the secondmixture. In some embodiments, one or more additives are added to thecombination of the first and second mixtures. Moreover, an additivedescribed herein can be provided in any amount not inconsistent with theobjectives of the present invention. In some embodiments, for instance,an additive is provided in an amount less than about 10 weight percent,less than about 5 weight percent, less than about 3 weight percent, lessthan about 2 weight percent or less than about 1 weight percent of themixture or combination of mixtures to which the additive is added. Insome embodiments, an additive is provided in an amount between about 1weight percent and about 10 weight percent or between about 1 weightpercent, and about 5 weight percent.

Further, any additive not inconsistent with the objectives of thepresent invention may be, used. In some embodiments, for example, anadditive comprises an ionic liquid. Any ionic liquid not inconsistentwith the objectives of the present invention may be used. In someembodiments, an ionic liquid is imidazolium-based. In other embodiments,an ionic liquid is pyridinium-based. In some embodiments, an ionicliquid is choline-based. Further, in some embodiments, an ionic liquidcomprises a sugar, sugar alcohol, or sugar derivative, such asglycol-choline, glycerol-choline, erythritol-choline, threitol-choline,arabitol-choline, xylitol-choline, ribitol-choline, mannitol-choline,sorbitol-choline, dulcitol-choline, iditol-choline, isomalt-choline,maltitol-choline, or lactitol-choline. Non-limiting examples of ionicliquids suitable for use in some embodiments described herein include1-Allyl-3-methylimidazolium bis(trifluormethylsulfonyl)imide,1-Allyl-3-methylimidazolium bromide, 1-Allyl-3 methylimidazoliumdicyanamide, 1-Allyl-3-methylimidazolium iodide,1-Benzyl-3-methylimidazolium chloride, 1-Benzyl-3-methylimidazoliumhexafluorophosphate, 1-Benzyl-3-methylimidazolium tetrafluoroborate,1,3-Bis(3-cyanopropyl)imidazolium bis(trifluoromethylsulfonyl)imide,1,3-Bis(3-cyanopropyl)imidazolium chloride,1-Butyl-2,3-dimethylimidazolium hexafluorophosphate,1-Butyl-2,3-dimethylimidazolium tetrafluoroborate,4-(3-Butyl-1-imidazolio)-1-butanesulfonate, 1-Butyl-3-methylimidazoliumacetate, 1-Butyl-3-methylimidazolium chloride,1-Butyl-3-methylimidazolium dibutyl, phosphate,1-Butyl-3-methylimidazolium hexafluorophosphate,1-Butyl-3-methylimidazolium nitrate, 1-Butyl-3-methylimidazolium octylsulfate, 1-Butyl-3-methylimidazolium tetrachloroaluminate,1-Butyl-3-methylimidazolium tetrafluoroborate,1-Butyl-3-methylimidazolium thiocyanate, 1-Butyl-3-methylimidazoliumtosylate, Butyl-3-methylimidazolium trifluoroacetate,1-Butyl-3-methylimidazolium trifluoromethanesulfonate,1-(3-Cyanopropyl)-3-methylimidazolium bis(trifluoromethylsulfonyl)amide,1-Decyl-3-methylimidazolium tetrafluoroborate, 1,3-Diethoxyimidazoliumbis(trifluoromethylsulfonyl)imide, 1,3-Diethoxyimidazoliumhexafluorophosphate, 1,3-Dihydroxyimidazoliumbis(trifluoromethylsulfonyl)imide, Dihydroxy-2-methylimidazoliumbis(trifluoromethylsulfonyl)imide, 1,3-Dimethoxy-2-methylimidazoliumhexafluorophosphate, 1-Dodecyl-3-methylimidazolium hexafluorophosphate,1-Ethyl-3-methylimidazolium L-(+)-lactate, 1-Ethyl-3-methylimidazolium1,1,2,2-tetrafluoroethanesulfonate, 1-Hexyl-3-methylimidazoliumbis(trifluoromethylsulfonyl)imide, 1-Hexyl-3-methylimidazolium chloride,1-Hexyl-3-methylimidazolium hexafluorophosphate, 1-Methylimidazoliumchloride, 1-Methyl-3-octylimidazolium chloride,1-Methyl-3-octylimidazolium tetrafluoroborate,1-Methyl-3-propylimidazolium iodide,1-Methyl-3-(3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl)imidazoliumhexafluorophosphate, 1,2,3-Trimethylimidazolium methyl sulfate,1-Butyl-4-methylpyridinium chloride, 1-Butyl-4-methylpyridiniumhexafluorophosphate, 1-Butylpyridinium bromide,1-(3-cyanopropyl)pyridinium chloride, 1-Ethylpyridiniumtetrafluoroborate, 3-Methyl-1-propylpyridiniumbis(trifluormethylsulfonyl)imide, and Cholin acetate, all availablecommercially from Sigma-Aldrich.

In some embodiments, an additive comprises a thermal conductivitymodulator. Any thermal conductivity modulator not inconsistent with theobjectives of the present invention may be used. In some embodiments,for instance, a thermal conductivity modulator comprises carbon,including graphitic carbon. In some embodiments, a thermal conductivitymodulator comprises carbon black and/or carbon nanoparticles. Carbonnanoparticles, in some embodiments, comprise carbon nanotubes and/orfullerenes. In some embodiments, a thermal conductivity modulatorcomprises a graphitic matrix structure. In other embodiments, a thermalconductivity modulator comprises an ionic liquid. In some embodiments, athermal conductivity modulator comprises a metal, including pure metalsand alloys. Any metal not inconsistent with the objectives of thepresent invention may be used. In some embodiments, a metal comprises atransition metal, such as silver or copper. In some embodiments, a metalcomprises an element from Group 13 or Group 14 of the periodic table. Insome embodiments, a metal comprises aluminum, in some embodiments, athermal conductivity modulator comprises a metallic filler, a metalmatrix structure, a metal tube, a metal plate, and/or metal shavings.Further, in some embodiments, a thermal conductivity modulator comprisesa metal oxide. Any metal oxide not. inconsistent with the objectives ofthe present invention may be used. In some embodiments, a metal oxidecomprises a transition metal oxide. In some embodiments, a metal oxidecomprises alumina.

In some embodiments, an additive comprises an antimicrobial material.Any antimicrobial material not inconsistent with the objectives of thepresent invention may be used. An antimicrobial material, in someembodiments, comprises an inorganic composition, including metals andcar metal salts. In some embodiments, for example, an antimicrobialmaterial comprises metallic copper, zinc, or silver or a salt of copper,zinc, or silver. Moreover, in some embodiments, an antimicrobialmaterial comprising a metal can also provide thermal conductivitymodulation. In other embodiments, an antimicrobial material comprises anorganic composition, including natural and synthetic organiccompositions. In some embodiments, an antimicrobial material comprises aβ-lactam such as a penicillin or cephalosporin. In some embodiments, anantimicrobial material comprises a protein synthesis inhibitor such asneomycin. In some embodiments, an antimicrobial material comprises anorganic acid, such as lactic acid, acetic acid, or citric acid. In someembodiments, an antimicrobial material comprises a quarternary ammoniumspecies. A quarternary ammonium species, in some embodiments, comprisesa long alkyl chain, such as an alkyl chain having a C8 to C28 backbone.In some embodiments, an antimicrobial material comprises one or more ofbenzalkonium chloride, benzethonium chloride, methylbenzethoniumchloride cetalkonium chloride, cetylpyridium chloride, cetrimonium,cetrimide, dofanium chloride, tetraethylammonium bromide,didecyldimethylammonium chloride, and domiphen bromide.

In some embodiments, an additive comprises a fire retardant. Any fireretardant not inconsistent with the objectives of the present inventionmay be used. In some embodiments, a fire retardant comprises a foam orgel. Further, in some embodiments, a fire retardant can comprise anorganic composition or an inorganic composition. In some embodiments, afire retardant comprises tris(2-chloro-1-(chloromethyl)ethyl)phosphate.In some embodiments, a fire retardant comprises aluminum hydroxideand/or magnesium hydroxide. In some embodiments, a fire retardantcomprises a zeolite, including a natural or synthetic zeolite describedherein.

Moreover, a method described herein, in some embodiments, comprisesproviding a plurality of additives. Any combination of additivesdescribed herein not inconsistent with the objectives of the presentinvention may be used. For instance, in some embodiments, a methodcomprises providing one or more thermal conductivity modulators, one ormore antimicrobial materials, and/or one or more fire retardants.

Some methods described herein are carried out using a plurality ofreaction vessels and/or using a plurality of mixtures. However, in someembodiments, a method of making a tam described herein can also becarried out in a single reaction vessel and/or using a single mixture.In some embodiments, for instance, a method of making a foam describedherein comprises combining a PCM with a hydrophobic sorption material toprovide a mixture, adding a polyfunctional monomer to the mixture, andadding a linker component to the mixture. In some embodiments, a methodfurther comprises adding a second linker component to the mixture. Insome embodiments, the second linker component is added to the mixtureprior to adding the polyfunctional monomer and linker component to themixture. In some embodiments, adding a second linker component to themixture comprises forming a chemical bond between the second linkercomponent and the PCM of the mixture as described hereinabove. Inaddition, in some embodiments, the polyfunctional monomer and linkercomponent are added to the mixture after a gel or pre-polymer has beenformed or partially formed in the mixture as described hereinabove.Moreover, in some embodiments, a polyfunctional monomer and linkercomponent are added to a mixture at a slow rate, such as a sufficientlyslow rate to avoid disruption of a gelling or pre-polymerization processdescribed hereinabove. Further, in some embodiments, addition of apolyfunctional monomer to a mixture is carried out at a temperaturegreater than a transition temperature of a PCM or latent heat storagematerial of the mixture. In addition, in some embodiments, a mixture ofa method described herein is free or substantially free of water.Moreover, as described hereinabove for methods comprising a plurality ofmixtures, in some embodiments, one or more catalysts, blowing agents,aqueous polymeric materials, and/or additives can also be added to asingle mixture described herein, including in any manner described,herein not inconsistent with the objectives of the present invention.Further, as described hereinabove for methods comprising a plurality ofmixtures, various components of a single mixture can be present in anyamount not inconsistent with the objectives of the present invention,and components can be mixed in any manner not inconsistent with theobjectives of the present invention, including at any temperature notinconsistent the objectives of the present invention.

A foam made by a method described herein, in some embodiments, can haveone or more desirable thermal properties. In some embodiments, forinstance, a foam made by a method described herein has a latent heat ofat least about 50 J/g. In some embodiments, a foam has a latent heat ofat least about 75 J/g. In some embodiments, a foam has a latent heat ofat least about 90 J/g. In some embodiments, a foam has a latent heat ofat least about 100 J/g. In some embodiments, a foam has a latent heat ofat least about 110 J/g, at least about 115 J/g, or at least about 125J/g. In some embodiments, a foam has a latent heat between about 50 J/gand about 150 J/g. In some embodiments, a foam has a latent heat betweenabout 75 J/g and about 125 J/g, between about 75 J/g and about 110 J/g,between about 75 J/g and about 100 J/g, between about 90 J/g and about125 J/g, or between about 90 J/g and about 110 J/g. Further, latent heatof a foam described herein is associated with a transition between twocondensed phases or states of a PCM or latent heat storage material ofthe foam, such as a transition tween a solid, phase and a liquid phase,between a solid phase and a mesophase, between a solid state and a gelstate, or between two solid states. A mesophase, in some embodiments,comprises a phase intermediate between a solid phase and a liquid phase.In addition, it is contemplated herein that, in some embodiments, a PCMor latent heat storage material may have more than one latent heatassociated with a transition between two condensed phases or states,such as a first latent heat associated with a crystallinesolid-amorphous solid transition and a second latent heat associatedwith a solid-liquid transition. In some embodiments comprising a PCM orlatent heat storage material having more than one latent heat associatedwith a transition between two condensed phases, one of the latent heatshas a value described hereinabove. In other embodiments, a plurality orall of the latent beats have a value described hereinabove.

Further, in some embodiments, a foam described herein exhibits otherdesirable properties for latent heat storage applications. For example,in some embodiments, a foam is non-flammable or substantiallynon-flammable. For reference purposes herein, a non-flammable orsubstantially non-flammable foam has a rating of A1, A2, or B2 whenmeasured according to DIN 4102. Moreover, in some embodiments, a foamdoes not “sweat” or release a PCM or latent heat storage material at atemperature above a transition temperature of the PCM or latent heatstorage material described herein, permitting the use of the foam invarious applications requiring little or no “sweating” or flow. In someembodiments, a foam described herein does not “sweat” due to theviscosity of a gel formed as described herein. In some embodiments, afoam described herein does not “sweat” due to cross-linking between oneor more components of the first and second mixtures described herein.Therefore, in some embodiments, foams described herein can be used. Invarious construction and engineering applications without the need formicroencapsulation of the PCM or latent heat storage material.

In addition, in some embodiments, a foam made by a method describedherein has a density, flexibility, and/or mechanical strength similar tothat of an otherwise similar foam not comprising a PCM or latent heatstorage material dispersed in the foam. For example, in someembodiments, a foam made by a method described herein has a densitybetween about 2 pounds per cubic foot (PCF) and about 8 PCF. Moreover,in some embodiments, a foam made by a method described herein comprisesan open-cell foam. Alternatively, in other embodiments, a foam made by amethod described herein comprises a closed-cell foam. In someembodiments, a foam made by a method described herein comprises apolyurethane foam. In some embodiments, a foam made by a methoddescribed herein comprises a polyester foam. In some embodiments, a foammade by a method described herein comprises a polystyrene foam.

In another aspect, compositions comprising a foam are described herein.In some embodiments, a composition comprises a foam and a latent heatstorage material dispersed in foam, the latent heat storage materialcomprising a phase change material and a hydrophobic sorption material.In some embodiments, the latent heat storage material is uniformly orsubstantially uniformly dispersed in the foam. For reference purposesherein, the dispersion of a latent heat storage material can bedetermined based on the weight of the latent heat storage material ineach 10 cm³ volume of foam. A uniform or substantially uniformdispersion exhibits a mono-modal normal distribution of latent heatstorage material within a random sampling of volume segments of thefoam. In other embodiments, the latent heat storage material isnon-uniformly dispersed in the foam. Moreover, in some embodiments, thelatent heat storage material is chemically bonded to the foam, includingthrough one or more covalent bonds. One or more covalent bonds, in someembodiments, comprises one or more cross-linking bonds between acomponent of the latent heat storage material and a component of thefoam, such as a urethane bond.

Further, in some embodiments, a PCM of a composition described hereincomprises an absorbate. For example, in some embodiments, a PCM is atleast partially absorbed by a hydrophobic sorption material of thelatent heat storage material. Moreover, in some embodiments ahydrophobic sorption material comprises an absorbent. In otherembodiments, a PCM is at least partially adsorbed by a hydrophobicsorption material. In some embodiments, for instance, a PCM comprises anadsorbate of the hydrophobic sorption material. In addition, in someembodiments, a hydrophobic sorption material adsorbs or absorbs ahydrophobic portion of a PCM, such as an aliphatic, hydrocarbon portionof a PCM.

Moreover, in some embodiments, the hydrophobic sorption material issaturated by the PCM. A hydrophobic sorption material saturated by aPCM, in some embodiments, is unable or substantially unable to absorb oradsorb additional chemical species, such as additional hydrophobicchemical species.

In addition, in some embodiments, a hydrophobic sorption materialdescribed herein partially encapsulates a PCM. In some embodiments, thehydrophobic sorption material does not comprise a microcapsule, such asa microcapsule encapsulating the PCM. In some embodiments, a compositiondescribed herein comprises a self-encapsulating latent heat storagematerial. In some embodiments, a PCM or latent heat storage materialdescribed herein is not encapsulated by a microcapsule, such as apolymer microcapsule.

Further, in some embodiments, a latent heat storage material of acomposition described herein comprises a gel. The gel comprises the PCMand the hydrophobic sorption material. Moreover, a gel, in someembodiments, comprises a continuous phase formed from the PCM. In otherembodiments, a gel comprises a discontinuous phase formed from the PCM.A phase comprising a PCM, in some embodiments, can be a liquid phase ora solid phase. In addition, in some embodiments, a gel comprises a solidphase formal from a hydrophobic sorption material of the composition.The solid phase, in some embodiments, is a continuous phase. Further, insome embodiments, a gel does not comprise water or is substantially freeof water.

Further, in some embodiments, a gel described herein has a viscositybetween about 200 cP and about 20,000 cP, between about 200 cP and about10,000 cP, between about 1000 cP and about 15,000 cP, or between about1000 cP and about 5000 cP measured according to ASTM standard D2983, Insome embodiments, a gel has a viscosity between about 200 cP and about50,000 cP at a temperature between about 20° C. and about 70° C. at 1atm. In some embodiments, a gel has a viscosity between about 200 and,about 25,000 cP, between about 200 cP and about 10,000 cP, or betweenabout 1000 cP and about 5000 cP at a temperature between about 20° C.and about 70° C. at 1 atm. Moreover, in some embodiments, a gel has aviscosity between about 5000 cP and about 20,000 cP at a temperaturebetween about −40° C. and about 40° C. at 1 atm or between about −30° C.and about 30° C. at 1 atm. In some embodiments, a gel has a viscositybetween about 5000 cP and about 20,000 cP at a temperature between about−50° C. and about 0° C. at 1 atm or between about −20° C. and about 0°C. at 1 atm. In other embodiments, a gel has a viscosity between about5000 cP and about 20,000 cP at a temperature between about 30° C. andabout 50° C. at 1 atm or between about 35° C. and about 45° C. at 1 atm.In some embodiments, a gel does not readily flow without the applicationof an external force or pressure. In some embodiments, a gel isself-supporting or non-encapsulated.

Further, in some embodiments, a PCM of a latent heat storage materialdescribed, herein is chemically bonded to a linker component of thelatent heat storage material. A PCM can be chemically bonded to a linkercomponent in any manner not inconsistent with the objectives of thepresent invention, including in a manner described hereinabove inSection III. In addition, a linker component can comprise any linkercomponent described hereinabove Section III, including a second linkercomponent.

In addition, in some embodiments, a composition described herein furthercomprises, an additive dispersed in the latent heat storage material.Further, in some embodiments, the latent heat storage material is freeor substantially free of water.

Moreover, a composition described herein, in some embodiments, exhibitsdesirable latent beat storage properties. In some embodiments, forinstance, a composition des bed herein has a condensed phase latent heatof at least about 50 J/g. In some embodiments, a composition has acondensed phase latent heat of at least about 75 J/g. In someembodiments, a composition has a condensed phase latent heat of at leastabout 90 J/g. In some embodiments, a composition has a condensed phaselatent heat of at least about 100 J/g. In some embodiments, acomposition has a condensed phase latent heat of at least about 110 J/g,at least about 115 J/g, or at least about 125 J/g in some embodiments, acomposition has a condensed phase latent heat between about 50 J/g andabout 150 J/g. In some embodiments, a composition has a condensed phaselatent heat between about 50 J/g, and about 125 J/g, between about 75J/g and about 125 J/g, between about 75 and about 110 J/g, between about75 J/g and about 100 J/g, between about 90 J/g and about 125 J/g, orbetween about 90 J/g, and about 110 J/g.

Further, in some embodiments, a composition described herein exhibitsother desirable properties for latent heat storage applications. Forexample, in some embodiments, a composition is non-flammable orsubstantially non-flammable. Moreover, in some embodiments, acomposition described herein does not “sweat” or release the latent heatstorage material at a temperature above a transition temperature of thelatent heat storage material described herein, permitting the use of thecomposition in various applications requiring little or no “sweating” orflow. In some embodiments, a composition described herein does not“sweat” due to one or more chemical bonds between the foam and thelatent heat storage material of the composition as described herein. Insome embodiments, as composition described herein does not “sweat” dueto the viscos of the latent heat storage material. Therefore, in someembodiments, compositions described herein can be used in variousconstruction and, engineering applications without the need formicroencapsulation of the latent heat storage material.

Turning now to specific embodiments of compositions, compositionsdescribed herein comprise, a foam. Any foam not inconsistent with theobjectives of the present invention may be used. In some embodiments, afoam comprises any foam described hereinabove in Section III, includinga polyurethane foam or polyester foam, Moreover, a foam can have anyproperty of a foam described hereinabove in Section III. For example, insome embodiments, a foam has a density, flexibility, and/or mechanicalstrength similar to that of an otherwise similar foam not comprising alatent heat storage material dispersed in the foam. In some embodiments,a foam has a density between about 2 PCF and about 8 PCP. Moreover, insome embodiments, a foam comprises an open-cell foam. Alternatively, inother embodiments, a foam comprises a closed-cell foam.

Compositions described herein also comprise a latent heat storagematerial dispersed in the foam. Any latent heat storage material notinconsistent with the objectives of the present invention may be used.In some embodiments, a latent heat storage material comprises any latentheat storage material described hereinabove in Section III. Further, alatent heat storage material of a composition described herein comprisesa PCM. Any PCM not inconsistent with the objectives of the presentinvention may be used. In some embodiments, PCM comprises a PCMdescribed hereinabove in Section III.

Further, in some embodiments of compositions described herein, a latentheat storage material comprises a PCM chemically bonded to a linkercomponent, the linker component can comprise any linker componentdescribed hereinabove in Section III, including a second linkercomponent.

Moreover, compositions described herein, its some embodiments comp seone or more additives dispersed in the latent heat storage material. Anyadditive not inconsistent with the objectives of the present inventionmay be used. In some embodiments, an additive comprises an additivedescribed hereinabove in Section III.

Some embodiments described herein are further illustrated in thefollowing non-limiting examples.

EXAMPLE 1 Composition Comprising a PCM

A composition comprising a PCM described herein was prepared as follows.First, 8 kg myristic acid (Univar) and 1.6 kg myristic alcohol (Univar)were added to a 10 gallon tank equipped with a mixer and heated at 70°C. Next, after 30 minutes of mixing, 0.3 kg hydroxypropyl cellulose(Ashland) and 0.1 kg of xylitol-choline chloride ionic liquid (QuarTek)were added gradually. Mixing was continued for another 10 minutes.

EXAMPLE 2 Composition Comprising a PCM

A composition comprising a PCM described herein was prepared as follows.First, 9.6 kg lauric acid (Univar) was added to a 10 gallon tankequipped with a mixer and heated at 50° C. Next, after 30 minutes ofmixing, 0.3 kg fumed silica aerogel (Cab-O-Sil, Cabot) and 0.1 kgxylitol-choline chloride ionic liquid (QuarTek) were added gradually.Mixing, was continued for another 10 minutes.

EXAMPLE 3 Composition Comprising a PCM

A composition comprising a PCM described herein was prepared as follows.First, 8 myristic acid (Univar) and 1.6 kg myristic alcohol (Univar)were added to a 10 gallon tank equipped with a mixer and heated at 70°C. Next, after 30 minutes of mixing, 0.3 kg filmed silica aerogel(Cab-O-Sil, Cabot) and 0.1 kg xylitol-choline chloride ionic liquid.(QuarTek) were added gradually. Mixing was continued for another 10minutes.

EXAMPLE 4 Composition Comprising a PCM

A composition comprising a PCM described herein was prepared as follows.First, 9.6 lauric acid (Univar) was added to a 10 gallon tank equippedwith a mixer and heated at 50° C. Next, after 30 minutes of mixing, 0.3kg fumed aerogel (Cab-O-Sil, Cabot) and 0.1 kg methylene diphenyldiisocyanate (BASF) were added gradually. Mixing was continued foranother 10 minutes.

EXAMPLE 5 Composition Comprising a PCM

A composition comprising a PCM described herein was prepared as follows.First, 9 kg lauryl alcohol (Univar) was added to a 10 gallon tankequipped with a mixer and heated at 30° C. Next, after 30 minutes ofmixing, 0.3 kg fumed silica aerogel (Cab-O-Sil, Cabot) and 0.1 kgmethylene diphenyl diisocyanate (BASF) were added gradually. Mixing wascontinued for another 10 minutes.

EXAMPLE 6 Composition Comprising a PCM

A composition comprising as PCM described herein was prepared asfollows. First, 9.6 kg lauryl alcohol (Univar) was added to as 10 gallontank equipped with a mixer and heated at 30° C. is after 30 minutes ofmixing, 0.3 kg fumed silica aerogel (Cab-O-Sil, Cabot) and 0.1 kgxylitol-choline chloride ionic liquid (QuarTek) were added gradually.Mixing was continued for another 10 minutes.

EXAMPLE 7 Composition Comprising a PCM

A composition comprising a PCM described herein was prepared as follows.First, 8 kg myristic acid (Univar) and 1.6 kg myristic alcohol (Univar)were added to a 10 gallon tank equipped with a mixer and heated at 70°C. Next, after 30 minutes of mixing, 0.3 kg fumed silica aerogel(Cab-O-Sil, Cabot) and 0.1 kg methylene diphenyl diisocyanate (BASF)were added gradually. Mixing was continued for another 10 minutes.

EXAMPLE 8 Composition Comprising a PCM

A composition comprising a PCM described herein was prepared as follows.First, 8 kg, myristic acid (Univar) and 1.6 kg myristic alcohol (Univar)were added to a 10 gallon tank equipped with a mixer and heated at 70°C. Next, after 30 minutes of mixing, 0.3 kg fumed silica aerogel(Cab-O-Sil, Cabot), 0.09 kg methylene diphenyl diisocyanate (BASF), and0.01 kg dibutyltin catalyst (D.B. Becker) were added gradually. Mixingwas continued for another 10 minutes.

EXAMPLE 9 Composition Comprising a PCM

A composition comprising a PCM described herein was prepared as follows.First, 8.3 kg lauric acid (Univar) was added to a 10 gallon tankequipped with a mixer and heated at 70° C. Next, after 15 minutes ofmixing. 1.5 kg SBC (G1651HU, Kraton Polymers) and 0.2 kg xylitol-cholinechloride ionic liquid (QuarTek) were added gradually. Mixing wascontinued for another 15 minutes at 90° C.

EXAMPLE 10 Composition Comprising a PCM

A composition comprising a PCM described herein was prepared as follows.First, 8.3 kg lauric acid (Univar) was added to a 10 gallon tankequipped with a mixer and heated at 70° C. Next, after 15 minutes ofmixing, 1.5 kg SBC (G1651HU, Kraton Polymers) and 0.2 kg methylenediphenyl diisocyanate (BASE) were added gradually. Mixing was continuedfor another 10 minutes.

EXAMPLE 11

Method of Making a Foam

A composition comprising a foam described herein was prepared asfollows. First, 250 g of the composition of Example 1 and 240 g castoroil (DIC Laboratories Inc.) were added to a 1 gallon tank equipped witha mixer. Next, after 2 minutes of mixing, 120 g methylene diphenyldiisocyanate (BASF), 2 g dibutyltin laurate, and 30 g water were addedsequentially to the tank. Mixing was carried out for one minute inbetween each addition. In addition, mixing was continued for anotherminute after the last addition. Then, the entire mixture was poured intoa container having a length, width, and height corresponding to thedesired dimensions of the foam composition.

EXAMPLE 12 Method of Making a Foam

A composition comprising a foam described herein was prepared asfollows. First, 250 g of the composition of Example 2 and 240 g castoroil (DIC Laboratories Inc.) were added to a 1 gallon tank equipped witha mixer. Next, after 2 minutes of mixing, 120 g methylene diphenyldiisocyanate (BASF), 2 g dibutyltin laurate, and 30 g water were addedsequentially to the tank. Mixing was carried out for one minute inbetween each addition. In addition, mixing was continued for anotherminute after the last addition. Then, the entire mixture was poured intoa container having a length, width, and height corresponding to thedesired dimensions of the foam composition.

EXAMPLE 13 Method of Making a Foam

A composition comprising a foam described herein was prepared asfollows. First, 250 g of the composition of Example 3 and 240 g castoroil (DIC Laboratories Inc.) were added to a 1 gallon tank equipped witha mixer. Next, after 2 minutes of mixing, 120 g methylene diphenyldiisocyanate (BASF), 2 g dibutyltin laurate, and 30 g water were addedsequentially to the tank. Mixing was carried out for one minute inbetween each addition. In addition, mixing was continued for anotherminute after the last addition. Then, the entire mixture was poured intoa container having a length, width, and height corresponding to thedesired dimensions of the foam composition.

EXAMPLE 14 Method of Making a Foam

A composition comprising a foam described herein was prepared asfollows. First, 240 g castor oil (DIC Laboratories Inc.) was placed in a1 gallon tank equipped with a mixer. Next, 120 g methylene diphenyldiisocyanate (BASF) was added to the tank, following by mixing for 1minute and then the addition of 2 g dibutyltin laurate. Then 250 g ofthe composition of Example 1 was added while mixing, followed by theaddition of 30 g water. Mixing was continued for another minute afterthe last addition. The entire mixture was then poured into a containerhaving a length, width, and height corresponding to the desireddimensions of the foam composition.

EXAMPLE 15 Method of Making a Foam

A composition comprising a foam described herein was prepared asfollows. First, 240 g castor oil (DIC Laboratories Inc.) was placed in a1 gallon tank equipped with a mixer. Next, 120 g methylene diphenyldiisocyanate (BASE) was added to the tank, following by mixing for 1minute and then the addition of 2 g dibutyltin laurate. Then 250 g ofthe composition of Example 2 was added while mixing, followed by theaddition of 30 g water. Mixing was continued for another minute afterthe last addition. The entire mixture was then poured into a containerhaving a length, width, and height corresponding to the desireddimensions of the foam composition.

EXAMPLE 16 Method or Making a Foam

A composition comprising a foam described herein was prepared asfollows. First, 240 g castor oil (Die Laboratories Inc.) was placed in a1 gallon tank equipped with a mixer. Next, 120 g methylene diphenyldiisocyanate (BASF) was added to the tank, following by mixing for 1minute and then the addition of 2 g dibutyltin laurate. Then 250 g ofthe composition of Example 3 was added while mixing, followed by theaddition of 30 g water. Mixing was continued for another minute, afterthe last addition. The entire mixture was then poured into a containerhaving a length, width, and height corresponding to the desireddimensions of the foam composition.

Various embodiments of the invention have been described in fulfillmentof the various objectives of the invention. It should be recognized thatthese embodiments are merely illustrative of the principles of thepresent invention. Numerous modifications and adaptations thereof willbe readily apparent to those skilled in the art without departing fromthe spirit and scope of the invention.

That which is claimed is:
 1. A composition comprising: a phase change material (PCM) comprising (a) one or more fatty acids, one or more alkyl esters of a fatty acid, one or more fatty alcohols, one or more fatty sulfonates or phosphonates, or a combination thereof; and (b) one or more inorganic salt hydrates, wherein the PCM is present in the composition in an amount of at least 95 weight percent, based on the total weight of the composition.
 2. The composition of claim 1 further comprising an ionic liquid.
 3. The composition of claim 2, wherein the ionic liquid is imidazolium-based, pyridinium-based, or choline-based.
 4. The composition of claim 2, wherein the ionic liquid comprises 1-Allyl-3-methylimidazolium bis(trifluoromethylsulfonyl)imide, 1-Allyl-3-methylimidazolium bromide, 1-Allyl-3-methylimidazolium dicyanamide, 1-Allyl-3-methylimidazolium iodide, 1-Benzyl-3-methylimidazolium chloride, 1-Benzyl-3-methylimidazolium hexafluorophosphate, 1-Benzyl-3-methylimidazolium tetrafluoroborate, 1,3-Bis(3-cyanopropyl)imidazolium bis(trifluoromethylsulfonyl)imide, 1,3-Bis(3-cyanopropyl)imidazolium chloride, 1-Butyl-2,3-dimethylimidazolium hexafluorophosphate, 1-Butyl-2,3-dimethylimidazolium tetrafluoroborate, 4-(3-Butyl-1-imidazolio)-1-butanesulfonate, 1-Butyl-3-methylimidazolium acetate, 1-Butyl-3-methylimidazolium chloride, 1-Butyl-3-methylimidazolium dibutyl phosphate, 1-Butyl-3-methylimidazolium hexafluorophosphate, 1-Butyl-3-methylimidazolium nitrate, 1-Butyl-3-methylimidazolium octyl sulfate, 1-Butyl-3-methylimidazolium tetrachloroaluminate, 1-Butyl-3-methylimidazolium tetrafluoroborate, 1-Butyl-3-methylimidazolium thiocyanate, 1-Butyl-3-methylimidazolium tosylate, 1-Butyl-3-methylimidazolium trifluoroacetate, 1-Butyl-3-methylimidazolium trifluoromethanesulfonate, 1-(3-Cyanopropyl)-3-methylimidazolium bis(trifluoromethylsulfonyl)amide, 1-Decyl-3-methylimidazolium tetrafluoroborate, 1,3-Diethoxyimidazolium bis(trifluoromethylsulfonyl)imide, 1,3-Diethoxyimidazolium hexafluorophosphate, 1,3-Dihydroxyimidazolium bis(trifluoromethylsulfonyl)imide, 1,3-Dihydroxy-2-methylimidazolium bis(trifluoromethylsulfonyl)imide, 1,3-Dimethoxy-2-methylimidazolium hexafluorophosphate, 1-Dodecyl-3-methylimidazolium iodide, 1-Ethyl-2,3-dimethylimidazolium tetrafluoroborate, 1-Ethyl-3-methylimidazolium hexafluorophosphate, 1-Ethyl-3-methylimidazolium L-(+)-lactate, 1-Ethyl-3-methylimidazolium 1,1,2,2-tetrafluoroethanesulfonate, 1-Hexyl-3-methylimidazolium bis(trifluormethylsulfonyl)imide, 1-Hexyl-3-methylimidazolium chloride, 1-Hexyl-3-methylimidazolium hexafluorophosphate, 1-Methylimidazolium chloride, 1-Methyl-3-octylimidazolium chloride, 1-Methyl-3-octylimidazolium tetrafluoroborate, 1-Methyl-3-propylimidazolium iodide, 1-Methyl-3-(3,3,4,4,5,5,6,6,7,7,8,8,8-tridecafluorooctyl)imidazolium hexafluorophosphate, 1,2,3-Trimethylimidazolium methyl sulfate, 1-Butyl-4-methylpyridinium chloride, 1-Butyl-4-methylpyridinium hexafluorophosphate, 1-Butylpyridinium bromide, 1-(3-Cyanopropyl)pyridinium chloride, 1-Ethylpyridinium tetrafluoroborate, 3-Methyl-1-propylpyridinium bis(trifluormethylsulfonyl)imide, or Cholin acetate.
 5. The composition of claim 2, wherein the ionic liquid comprises a sugar, sugar alcohol, or sugar derivative.
 6. The composition of claim 5, wherein the ionic liquid comprises glycol-choline, glycerol-choline, erythritol-choline, threitol-choline, arabitol-choline, xylitol-choline, ribitol-choline, mannitol-choline, sorbitol-choline, dulcitol-choline, iditol-choline, isomalt-choline, maltitol-choline, or lactitol-choline.
 7. The composition of claim 1, wherein the PCM comprises one or more fatty acids or alkyl esters of a fatty acid.
 8. The composition of claim 1, wherein the PCM comprises one or more fatty alcohols.
 9. The composition of claim 1, wherein the PCM comprises a plurality of differing fatty acids, alkyl esters of a fatty acid, fatty alcohols, fatty sulfonates and/or fatty phosphonates.
 10. The composition of claim 1, wherein the PCM comprises a C4 to C28 aliphatic hydrocarbon tail.
 11. The composition of claim 10, wherein the aliphatic hydrocarbon tail is saturated or unsaturated.
 12. The composition of claim 10, wherein the aliphatic hydrocarbon tail is branched or linear.
 13. The composition of claim 1, wherein the inorganic salt hydrate comprises KF⋅4H₂O, Mn(NO₃)₂⋅6H₂O, CaCl₂⋅6H₂O, CaBr₂⋅6H₂O, Li(NO₃)⋅6H₂O, Na₂SO₄⋅10H₂O, Na₂CO₃⋅10H₂O, Na₂HPO₄⋅12H₂O, Zn(NO₃)₂⋅6H₂O, Ca(NO₃)₂⋅3H₂O, Na(NO₃)₂⋅6H₂O, Zn(NO₃)₂⋅2H₂O, FeCl₃⋅2H₂O, Co(NO₃)₂⋅6H₂O, Ni(NO₃)₂⋅6H₂O, MnCl₂⋅4H₂O, CH₃COONa⋅3H₂O, LiC₂H₃O₂⋅2H₂O, MgCl₂⋅4H₂O, NaOH⋅H₂O, Cd(NO₃)₂⋅4H₂O, Cd(NO₃)₂⋅1H₂O, Fe(NO₃)₂⋅6H₂O, NaAl(SO₄)₂⋅12H₂O, FeSO₄⋅7H₂O, Na₃PO₄⋅12H₂O, Na₂B₄O₇⋅10H₂O, Na₃PO₄⋅12H₂O, LiCH₃COO⋅H₂O, or a mixture thereof.
 14. The composition of claim 13, wherein the inorganic salt hydrate comprises a phosphate and/or sulfate salt hydrate.
 15. The composition of claim 1, wherein the composition has a solid-to-gel transition between −50° C. and 100° C. at 1 atm, and a latent heat of at least 100 J/g.
 16. The composition of claim 1, wherein the composition is free or substantially free of water.
 17. The composition of claim 1, wherein the composition is non-flammable or substantially non-flammable.
 18. The composition of claim 1, wherein the composition consists essentially of the PCM and the one or more inorganic salt hydrates.
 19. The composition of claim 13, wherein the inorganic salt hydrate comprises a nitrate salt hydrate.
 20. The composition of claim 13, wherein the inorganic salt hydrate comprises a chloride salt hydrate. 